Inventor · disambiguated record
Tung-He Chou
Also filed as: CHOU TUNG-HE
10 granted patents·3 pending applications·10 citations·filing 2017–2024
82Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13
Top patents by PatentIndex Score
13 records- 0192US11081334B2Particle prevention in wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·6 cites·20 claims
- 0289US2025102887A1Device with a recessed gate electrode that has high thickness uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0386US12204232B2Semiconductor device having a gate electrode with a top peripheral portion and a top central portion, and the top peripheral portion is a protrusion or a depression surrounding the top central portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0482US10857651B2Apparatus of chemical mechanical polishing and operating method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 8, 2020·3 cites·20 claims
- 0581US11846871B2Device with a recessed gate electrode that has high thickness uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 0679US12183571B2Integrated aligned stealth laser for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 31, 2024·0 cites·20 claims
- 0776US2025079150A1Integrated stealth laser for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0872US11445104B2Device with a recessed gate electrode that has high thickness uniformityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 13, 2022·0 cites·20 claims
- 0971US10879077B2Planarization apparatus and planarization method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 29, 2020·1 cites·20 claims
- 1068US11605534B2Particle prevention in wafer edge trimmingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 14, 2023·0 cites·20 claims
- 1156US11901171B2Integrated aligned stealth laser with blade and grinding apparatus for wafer edge trimming processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 13, 2024·0 cites·20 claims
- 1256US2025038073A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1342US11351648B2Chemical mechanical polishing apparatus, slurry, and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jun 7, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →