Inventor · disambiguated record
Kyungsoo Rho
Also filed as: RHO KYUNGSOO
2 granted patents·1 pending application·97 citations·filing 2004–2006
67Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0188US7087461B2Process and lead frame for making leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 8, 2006·71 cites·20 claims
- 0275US7169651B2Process and lead frame for making leadless semiconductor packagesADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 30, 2007·26 cites·22 claims
- 0334US2006255449A1Lid used in package structure and the package structure having the sameLEE YONGGILL·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →