Inventor · disambiguated record
Yasushi Okura
Also filed as: OKURA YASUSHI
8 granted patents·2 pending applications·106 citations·filing 2002–2023
85Inventor score
Top patents by PatentIndex Score
10 records- 0192US8076718B2Insulated gate semiconductor device and method for producing the sameTAKAYA HIDEFUMI·Filed 2005·Granted Dec 13, 2011·34 cites·8 claims
- 0291US7586151B2Insulated gate semiconductor deviceTOYOTA MOTOR CO LTD·Filed 2005·Granted Sep 8, 2009·23 cites·7 claims
- 0387US11362012B2Semiconductor deviceDENSO CORP·Filed 2020·Granted Jun 14, 2022·2 cites·10 claims
- 0477US7470953B2Insulated gate type semiconductor device and manufacturing method thereofTOYOTA MOTOR CO LTD·Filed 2004·Granted Dec 30, 2008·25 cites·20 claims
- 0574US6803667B2Semiconductor device having a protective filmDENSO CORP·Filed 2002·Granted Oct 12, 2004·22 cites·38 claims
- 0665US11869961B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·9 claims
- 0753US11804423B2Semiconductor deviceDENSO CORP·Filed 2022·Granted Oct 31, 2023·0 cites·8 claims
- 0852US11264490B2Semiconductor device and method of manufacturing semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2018·Granted Mar 1, 2022·0 cites·13 claims
- 0952US2023223310A1Element package and semiconductor deviceDENSO CORP·Filed 2023·Application pending·0 cites
- 1047US2022005743A1Semiconductor module and semiconductor device used thereforDENSO CORP·Filed 2021·Application pending·0 cites
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