Inventor · disambiguated record
Yukihiro Maegawa
Also filed as: MAEGAWA YUKIHIRO
7 granted patents·2 pending applications·33 citations·filing 2001–2021
81Inventor score
Top patents by PatentIndex Score
9 records- 0187US7615406B2Electronic device package manufacturing method and electronic device packagePANASONIC CORP·Filed 2006·Granted Nov 10, 2009·18 cites·14 claims
- 0267US6864640B2Plasma processing method and apparatus thereofMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 8, 2005·7 cites·40 claims
- 0361US7638888B2Semiconductor chip mounting substrate, semiconductor chip mounting body, semiconductor chip stacked module, and semiconductor chip mounting substrate manufacturing methodPANASONIC CORP·Filed 2008·Granted Dec 29, 2009·2 cites·21 claims
- 0459US12358268B2Laminating devicePANASONIC HOLDINGS CORP·Filed 2021·Granted Jul 15, 2025·0 cites·6 claims
- 0559US7406925B2Plasma processing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Aug 5, 2008·3 cites·3 claims
- 0650US6830653B2Plasma processing method and apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 14, 2004·1 cites·6 claims
- 0750US6707253B2Matching circuit and plasma processing apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 16, 2004·2 cites·10 claims
- 0841US2004045669A1Plasma processing method and apparatusFiled 2003·Application pending·0 cites
- 0936US2002038791A1Plasma processing method and apparatusFiled 2001·Application pending·0 cites
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