Inventor · disambiguated record
Cemil Geyik
Also filed as: GEYIK CEMIL · GEYIK CEMIL S · GEYIK CEMIL SERDAR
6 granted patents·9 pending applications·7 citations·filing 2017–2023
71Inventor score
Technology areasH10W
Files withINTEL CORP15
Top patents by PatentIndex Score
15 records- 0182US10840196B1Trace modulations in connectors for integrated-circuit packagesINTEL CORP·Filed 2019·Granted Nov 17, 2020·4 cites·16 claims
- 0277US11869842B2Scalable high speed high bandwidth IO signaling package architecture and method of makingINTEL CORP·Filed 2019·Granted Jan 9, 2024·2 cites·17 claims
- 0369US2024088047A1Scalable high speed high bandwidth io signaling package architecture and method of makingINTEL CORP·Filed 2023·Application pending·0 cites
- 0463US10303225B2Methods of forming hybrid socket structures for package interconnect applications and structures formed therebyINTEL CORP·Filed 2017·Granted May 28, 2019·1 cites·25 claims
- 0554US2024113049A1Package substrate with open air gap structuresINTEL CORP·Filed 2022·Application pending·0 cites
- 0653US2023420377A1Packaging architecture with trench via routing for on-package high-speed interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 0753US2023420347A1Packaging architecture with rounded traces for on-package high-speed interconnectsINTEL CORP·Filed 2022·Application pending·0 cites
- 0852US11810859B2Multi-layered adhesion promotion filmsINTEL CORP·Filed 2020·Granted Nov 7, 2023·0 cites·19 claims
- 0952US2023352416A1Methods and apparatus to improve signal integrity performance in integrated circuit packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1052US2023420358A1Integrated circuit packages with silver and silicon nitride multi-layerINTEL CORP·Filed 2022·Application pending·0 cites
- 1151US11508676B2Density-graded adhesion layer for conductorsINTEL CORP·Filed 2019·Granted Nov 22, 2022·0 cites·20 claims
- 1251US2024063100A1Skip layer with air gap on glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 1346US2023420298A1Multi-pathway routing via through holeINTEL CORP·Filed 2022·Application pending·0 cites
- 1445US12009320B2Interconnect loss of high density package with magnetic materialINTEL CORP·Filed 2019·Granted Jun 11, 2024·0 cites·12 claims
- 1536US2020315023A1Copper interface features for high speed interconnect applicationsINTEL CORP·Filed 2019·Application pending·0 cites
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