Inventor · disambiguated record
Jiyeon Han
Also filed as: HAN JIYEON
11 granted patents·1 pending application·16 citations·filing 2014–2023
84Inventor score
Top patents by PatentIndex Score
12 records- 0183US10998942B2Hybrid beam forming-based open-loop MIMO transmission method and apparatus thereforSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 4, 2021·5 cites·20 claims
- 0276US10952642B2Strain sensor unit and skin sensor module comprising the sameAMOREPACIFIC CORP·Filed 2017·Granted Mar 23, 2021·2 cites·8 claims
- 0375US10804975B2Hybrid beamforming-based open-loop MIMO transmission method and apparatus thereforSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Oct 13, 2020·2 cites·12 claims
- 0469US10898138B2Flexible patch including a plurality of through holes which can be adhered to skin and method for manufacturing the sameAMOREPACIFIC CORP·Filed 2018·Granted Jan 26, 2021·1 cites·9 claims
- 0568US11109796B2Electronic device which can be adhered to skin and method for manufacturing the sameAMOREPACIFIC CORP·Filed 2018·Granted Sep 7, 2021·1 cites·31 claims
- 0657US11076775B2Strain sensor unit and skin sensor module comprising the sameAMOREPACIFIC CORP·Filed 2019·Granted Aug 3, 2021·0 cites·9 claims
- 0750US12329539B2Non-invasive skin sensor for long-term monitoring and method for fabricating the sameAMOREPACIFIC CORP·Filed 2022·Granted Jun 17, 2025·0 cites·17 claims
- 0850US12128123B2Moldable composition for solid washing agent and method for molding the sameAMOREPACIFIC CORP·Filed 2022·Granted Oct 29, 2024·0 cites·14 claims
- 0948US12431442B2Semiconductor chips having recessed regionsSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·20 claims
- 1048US2024047328A1Semiconductor package with substrate cavitySAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1146USD884708SIntelligent docking stationSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted May 19, 2020·5 cites·1 claims
- 1241US11474149B2Test apparatuses for testing semiconductor packages and manufacturing systems for manufacturing semiconductor packages having the same and methods of manufacturing the semiconductor packages using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
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