Inventor · disambiguated record
Yukimasa Hayashida
Also filed as: HAYASHIDA YUKIMASA
24 granted patents·4 pending applications·82 citations·filing 2006–2021
93Inventor score
Top patents by PatentIndex Score
28 records- 0188USD798832SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 3, 2017·35 cites·1 claims
- 0282USD790491SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 27, 2017·23 cites·1 claims
- 0381US11063025B2Semiconductor module and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jul 13, 2021·4 cites·20 claims
- 0478US9899328B2Power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Feb 20, 2018·5 cites·17 claims
- 0569US11049803B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Jun 29, 2021·1 cites·16 claims
- 0668US7514777B2Power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Apr 7, 2009·5 cites·10 claims
- 0766US9941255B2Power semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2014·Granted Apr 10, 2018·2 cites·17 claims
- 0865US10748830B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Aug 18, 2020·1 cites·10 claims
- 0962US8569890B2Power semiconductor device moduleMORISHITA KAZUHIRO·Filed 2012·Granted Oct 29, 2013·2 cites·19 claims
- 1062US7554192B2Semiconductor device having filler with thermal conductive particlesMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jun 30, 2009·3 cites·3 claims
- 1151US11569141B2Semiconductor device including a groove within a resin insulating part positioned between and covering parts of a first electrode and a second electrodeMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Jan 31, 2023·0 cites·22 claims
- 1250US12308305B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 20, 2025·0 cites·13 claims
- 1348US2023352380A1Method for manufacturing semiconductor device, semiconductor device, electric power conversion device, and mobile bodyMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1446US11239124B2Semiconductor device and method of manufacturing semiconductor device, power conversion device, and moving bodyMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Feb 1, 2022·0 cites·12 claims
- 1545US11996299B2Methods for manufacturing a semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 28, 2024·0 cites·3 claims
- 1644US10804253B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Oct 13, 2020·0 cites·6 claims
- 1744US9585279B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Feb 28, 2017·0 cites·7 claims
- 1843US10483175B2Power semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 19, 2019·0 cites·7 claims
- 1943US10325827B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2013·Granted Jun 18, 2019·0 cites·20 claims
- 2043US2022238459A1Semiconductor device, power conversion device and moving bodyMITSUBISHI ELECTRIC CORP·Filed 2019·Application pending·0 cites
- 2141US7405448B2Semiconductor device having a resistance for equalizing the current distributionMITSUBISHI ELECTRIC CORP·Filed 2006·Granted Jul 29, 2008·0 cites·7 claims
- 2240US10692794B2Radiation plate structure, semiconductor device, and method for manufacturing radiation plate structureMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jun 23, 2020·0 cites·7 claims
- 2339US2014291701A1Semiconductor deviceHAYASHIDA YUKIMASA·Filed 2012·Application pending·0 cites
- 2438US11488896B2Semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Nov 1, 2022·0 cites·17 claims
- 2538US10361136B2Semiconductor device and semiconductor module provided with sameMITSUBISHI ELECTRIC CORP·Filed 2015·Granted Jul 23, 2019·0 cites·18 claims
- 2638US2012153451A1Semiconductor deviceHAYASHIDA YUKIMASA·Filed 2011·Application pending·0 cites
- 2733USD827590SPower semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Sep 4, 2018·1 cites·1 claims
- 2831US9363914B2Semiconductor deviceYASUTOMI Goro·Filed 2012·Granted Jun 7, 2016·0 cites·4 claims
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