Inventor · disambiguated record
Meiyu Piao
Also filed as: PIAO MEIYU
5 granted patents·7 citations·filing 2017–2019
67Inventor score
Technology areasH10P
Files withDISCO CORP5
Top patents by PatentIndex Score
5 records- 0183US9934957B2Method of processing bonded waferDISCO CORP·Filed 2017·Granted Apr 3, 2018·5 cites·1 claims
- 0274US10784166B2Wafer processing methodDISCO CORP·Filed 2019·Granted Sep 22, 2020·2 cites·4 claims
- 0343US10991622B2Wafer processing methodDISCO CORP·Filed 2019·Granted Apr 27, 2021·0 cites·7 claims
- 0434US10691090B2Method of processing device waferDISCO CORP·Filed 2018·Granted Jun 23, 2020·0 cites·4 claims
- 0532US10777460B2Processing method of workpieceDISCO CORP·Filed 2019·Granted Sep 15, 2020·0 cites·7 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →