Inventor · disambiguated record
Takako Ejiri
Also filed as: EJIRI TAKAKO
4 granted patents·1 pending application·17 citations·filing 2005–2020
69Inventor score
Top patents by PatentIndex Score
5 records- 0180US7740936B2Adhesion assisting agent fitted metal foil, and printed wiring board using thereofHITACHI CHEMICAL CO LTD·Filed 2005·Granted Jun 22, 2010·11 cites·24 claims
- 0275US8956732B2Polyamideimide resin, adhesive agent, material for flexible substrate, flexible laminate, and flexible print wiring boardTAKEUCHI MASAKI·Filed 2007·Granted Feb 17, 2015·3 cites·14 claims
- 0367US8236906B2Polyamide-imide resin, process for production of polyamide resin, and curable resin compositionEJIRI TAKAKO·Filed 2007·Granted Aug 7, 2012·3 cites·7 claims
- 0445US11905412B2Resin composition, prepreg, laminate, multilayer printed wiring board, and semiconductor packageSHOWA DENKO MATERIALS CO LTD·Filed 2020·Granted Feb 20, 2024·0 cites·16 claims
- 0542US2010243303A1Circuit connecting material, connection structure of circuit member, and method for manufacturing connection structure of circuit memberHITACHI CHEMICAL CO LTD·Filed 2007·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →