Inventor · disambiguated record
Ryo Kanai
Also filed as: KANAI RYO
10 granted patents·7 pending applications·10 citations·filing 2007–2022
81Inventor score
Top patents by PatentIndex Score
17 records- 0183US9709619B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2013·Granted Jul 18, 2017·5 cites·4 claims
- 0277US10863629B2Method of manufacturing through hole of substrateFUJITSU LTD·Filed 2019·Granted Dec 8, 2020·2 cites·5 claims
- 0368US2023105551A1Semiconductor device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2022·Application pending·0 cites
- 0465US9295155B2Flexible printed boardNAKAMURA NAOKI·Filed 2012·Granted Mar 22, 2016·1 cites·2 claims
- 0564US8269114B2Flexible printed boardNAKAMURA NAOKI·Filed 2010·Granted Sep 18, 2012·1 cites·3 claims
- 0663US9591763B2Substrate with embedded componentFUJITSU LTD·Filed 2016·Granted Mar 7, 2017·1 cites·9 claims
- 0755US10605851B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2017·Granted Mar 31, 2020·0 cites·1 claims
- 0854US10624216B2Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring boardFUJITSU LTD·Filed 2018·Granted Apr 14, 2020·0 cites·13 claims
- 0952US2021296356A1Semiconductor device and semiconductor device manufacturing methodKIOXIA CORP·Filed 2020·Application pending·0 cites
- 1048US8305767B2Printed wiring board reliably achieving electric connection with electronic componentNAKAMURA NAOKI·Filed 2007·Granted Nov 6, 2012·0 cites·6 claims
- 1147US10342129B2Substrate and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Jul 2, 2019·0 cites·4 claims
- 1247US2009139750A1Printed wiring board and printed circuit board unit and electronic apparatusFUJITSU LTD·Filed 2009·Application pending·0 cites
- 1345US10393797B2Inspection method of laminated board, inspection module, and palletFUJITSU LTD·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 1442US2011132654A1Multilayer printed circuit board, method for manufacturing the same, and electronic apparatusFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1541US2008066953A1Circuit board assembly and manufacturing method thereof, electronic part assembly and manufacturing method thereof, and electronic deviceFUJITSU LTD·Filed 2007·Application pending·0 cites
- 1637US2017196077A1Rigid flexible board and method for manufacturing the sameFUJITSU LTD·Filed 2016·Application pending·0 cites
- 1736US2011286188A1Multilayer printed circuit board using flexible interconnect structure, and method of making sameKANAI RYO·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →