Inventor · disambiguated record
Kiyoyuki Hatanaka
Also filed as: HATANAKA KIYOYUKI
9 granted patents·6 pending applications·10 citations·filing 2005–2019
79Inventor score
Top patents by PatentIndex Score
15 records- 0183US9709619B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2013·Granted Jul 18, 2017·5 cites·4 claims
- 0277US10863629B2Method of manufacturing through hole of substrateFUJITSU LTD·Filed 2019·Granted Dec 8, 2020·2 cites·5 claims
- 0363US9591763B2Substrate with embedded componentFUJITSU LTD·Filed 2016·Granted Mar 7, 2017·1 cites·9 claims
- 0455US10605851B2Printed wiring board, crack prediction device, and crack prediction methodFUJITSU LTD·Filed 2017·Granted Mar 31, 2020·0 cites·1 claims
- 0554US10624216B2Wiring board, electronic apparatus, method for attaching sheet metal covers, and method for manufacturing wiring boardFUJITSU LTD·Filed 2018·Granted Apr 14, 2020·0 cites·13 claims
- 0647US10342129B2Substrate and method of manufacturing the sameFUJITSU LTD·Filed 2018·Granted Jul 2, 2019·0 cites·4 claims
- 0746US7101205B2Electronic apparatusFUJITSU LTD·Filed 2005·Granted Sep 5, 2006·2 cites·16 claims
- 0845US10393797B2Inspection method of laminated board, inspection module, and palletFUJITSU LTD·Filed 2017·Granted Aug 27, 2019·0 cites·12 claims
- 0942US2011240352A1Printed circuit board and method of fabricating printed circuit boardFUJITSU LTD·Filed 2011·Application pending·0 cites
- 1042US2011132654A1Multilayer printed circuit board, method for manufacturing the same, and electronic apparatusFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1140US2010200643A1Method for producing electronic part unitFUJITSU LTD·Filed 2010·Application pending·0 cites
- 1237US8456854B2Method of repair of electronic device and repair systemIRIGUCHI SHIGEO·Filed 2008·Granted Jun 4, 2013·0 cites·4 claims
- 1337US2011240355A1Printed circuit board unit, electronic device and method of fabricating printed circuit boardFUJITSU LTD·Filed 2011·Application pending·0 cites
- 1437US2017196077A1Rigid flexible board and method for manufacturing the sameFUJITSU LTD·Filed 2016·Application pending·0 cites
- 1536US2011286188A1Multilayer printed circuit board using flexible interconnect structure, and method of making sameKANAI RYO·Filed 2011·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →