Inventor · disambiguated record
Xiaofeng Di
Also filed as: DI XIAOFENG
4 granted patents·5 citations·filing 2017–2021
59Inventor score
Top patents by PatentIndex Score
4 records- 0181US10483239B2Semiconductor device including dual pad wire bond interconnectionSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2018·Granted Nov 19, 2019·5 cites·22 claims
- 0251US11749647B2Semiconductor device including vertical wire bondsWESTERN DIGITAL TECH INC·Filed 2020·Granted Sep 5, 2023·0 cites·18 claims
- 0349US11901327B2Wire bonding for semiconductor devicesWESTERN DIGITAL TECH INC·Filed 2021·Granted Feb 13, 2024·0 cites·11 claims
- 0438US10283485B2Semiconductor device including conductive bump interconnectionsSANDISK SEMICONDUCTOR SHANGHAI CO LTD·Filed 2017·Granted May 7, 2019·0 cites·22 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →