Inventor · disambiguated record
Terh Kuen Yii
Also filed as: YII TERH KUEN
6 granted patents·122 citations·filing 2007–2011
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0194US7714418B2Leadframe panelNAT SEMICONDUCTOR CORP·Filed 2007·Granted May 11, 2010·64 cites·20 claims
- 0285US8097934B1Delamination resistant device package having low moisture sensitivityLI FELIX C·Filed 2008·Granted Jan 17, 2012·16 cites·42 claims
- 0385US7763958B1Leadframe panel for power packagesNAT SEMICONDUCTOR CORP·Filed 2007·Granted Jul 27, 2010·15 cites·20 claims
- 0484US7838980B1TO263 device package having low moisture sensitivityNAT SEMICONDUCTOR CORP·Filed 2007·Granted Nov 23, 2010·14 cites·12 claims
- 0581US7582954B1Optical leadless leadframe packageNAT SEMICONDUCTOR CORP·Filed 2008·Granted Sep 1, 2009·11 cites·7 claims
- 0665US8736042B2Delamination resistant device package having raised bond surface and mold locking apertureLI FELIX C·Filed 2011·Granted May 27, 2014·2 cites·15 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →