Inventor · disambiguated record
Yan Borodovsky
Also filed as: BORODOVSKY YAN · BORODOVSKY YAN A
37 granted patents·9 pending applications·680 citations·filing 1984–2019
97Inventor score
Top patents by PatentIndex Score
46 records- 0198US5424154ALithographic emhancement method and apparatus for randomly spaced structuresINTEL CORP·Filed 1993·Granted Jun 13, 1995·186 cites·44 claims
- 0295US5498579AMethod of producing semiconductor device layer layoutINTEL CORP·Filed 1994·Granted Mar 12, 1996·115 cites·20 claims
- 0393US5532090AMethod and apparatus for enhanced contact and via lithographyINTEL CORP·Filed 1995·Granted Jul 2, 1996·108 cites·23 claims
- 0490US10014256B2Unidirectional metal on layer with ebeamINTEL CORP·Filed 2014·Granted Jul 3, 2018·10 cites·10 claims
- 0588US7512926B2Phase-shifting masks with sub-wavelength diffractive optical elementsINTEL CORP·Filed 2005·Granted Mar 31, 2009·8 cites·7 claims
- 0686US9899182B2Corner rounding correction for electron beam (Ebeam) direct write systemINTEL CORP·Filed 2014·Granted Feb 20, 2018·6 cites·25 claims
- 0785US8975138B2Method of creating a maskless air gap in back end interconnects with double self-aligned viasCHANDHOK MANISH·Filed 2013·Granted Mar 10, 2015·9 cites·14 claims
- 0885US7142282B2Device including contactsINTEL CORP·Filed 2003·Granted Nov 28, 2006·20 cites·25 claims
- 0980US10191376B2Cross scan proximity correction with ebeam universal cutterINTEL CORP·Filed 2014·Granted Jan 29, 2019·3 cites·22 claims
- 1078US6021009AMethod and apparatus to improve across field dimensional control in a microlithography toolINTEL CORP·Filed 1998·Granted Feb 1, 2000·43 cites·23 claims
- 1177US6069739AMethod and lens arrangement to improve imaging performance of microlithography exposure toolINTEL CORP·Filed 1998·Granted May 30, 2000·51 cites·19 claims
- 1275US10747115B2Cross scan proximity correction with ebeam universal cutterINTEL CORP·Filed 2018·Granted Aug 18, 2020·1 cites·22 claims
- 1372US8122388B2Phase-shifting masks with sub-wavelength diffractive optical elementsHU BIN·Filed 2008·Granted Feb 21, 2012·2 cites·8 claims
- 1471US7732106B2Methods for etching devices used in lithographyINTEL CORP·Filed 2008·Granted Jun 8, 2010·2 cites·18 claims
- 1570US10067416B2Ebeam three beam aperture arrayINTEL CORP·Filed 2018·Granted Sep 4, 2018·1 cites·23 claims
- 1669US7611806B2Sub-wavelength diffractive elements to reduce corner roundingINTEL CORP·Filed 2005·Granted Nov 3, 2009·2 cites·12 claims
- 1767US10386722B2Ebeam staggered beam aperture arrayINTEL CORP·Filed 2014·Granted Aug 20, 2019·1 cites·24 claims
- 1866US10290528B2Ebeam align on the flyINTEL CORP·Filed 2014·Granted May 14, 2019·1 cites·20 claims
- 1966US4529685AMethod for making integrated circuit devices using a layer of indium arsenide as an antireflective coatingADVANCED MICRO DEVICES INC·Filed 1984·Granted Jul 16, 1985·26 cites·17 claims
- 2064US9897908B2Ebeam three beam aperture arrayINTEL CORP·Filed 2014·Granted Feb 20, 2018·1 cites·24 claims
- 2164US9324652B2Method of creating a maskless air gap in back end interconnections with double self-aligned viasINTEL CORP·Filed 2015·Granted Apr 26, 2016·1 cites·12 claims
- 2264US7892706B2Sub-wavelength diffractive elements to reduce corner roundingINTEL CORP·Filed 2008·Granted Feb 22, 2011·1 cites·14 claims
- 2364US5840448APhase shifting mask having a phase shift that minimizes critical dimension sensitivity to manufacturing and process varianceINTEL CORP·Filed 1996·Granted Nov 24, 1998·22 cites·17 claims
- 2463US5946079APhotolithography method using coherence distance controlINTEL CORP·Filed 1997·Granted Aug 31, 1999·18 cites·4 claims
- 2559US10216087B2Ebeam universal cutterINTEL CORP·Filed 2014·Granted Feb 26, 2019·0 cites·8 claims
- 2659US5801821APhotolithography method using coherence distance controlINTEL CORP·Filed 1995·Granted Sep 1, 1998·15 cites·13 claims
- 2758US8112726B2Phase-shifting masks with sub-wavelength diffractive optical elementsHU BIN·Filed 2008·Granted Feb 7, 2012·0 cites·20 claims
- 2857US10578970B2Ebeam universal cutterINTEL CORP·Filed 2019·Granted Mar 3, 2020·0 cites·17 claims
- 2954US7254803B2Test structures for feature fidelity improvementINTEL CORP·Filed 2004·Granted Aug 7, 2007·4 cites·50 claims
- 3054US4767215ALens characterization apparatus and methodATEOQ CORP·Filed 1986·Granted Aug 30, 1988·17 cites·24 claims
- 3150US7245352B2Alignment using latent imagesINTEL CORP·Filed 2004·Granted Jul 17, 2007·2 cites·30 claims
- 3249US2006017910A1Composite printingBORODOVSKY YAN·Filed 2005·Application pending·0 cites
- 3348US9952511B2Ebeam non-universal cutterINTEL CORP·Filed 2014·Granted Apr 24, 2018·0 cites·23 claims
- 3445US10338474B2Underlying absorbing or conducting layer for Ebeam direct write (EBDW) lithographyINTEL CORP·Filed 2015·Granted Jul 2, 2019·0 cites·25 claims
- 3545US2017069509A1Data compression for ebeam throughputINTEL CORP·Filed 2014·Application pending·0 cites
- 3644US10236161B2Fine alignment system for electron beam exposure systemINTEL CORP·Filed 2015·Granted Mar 19, 2019·0 cites·16 claims
- 3743US7438997B2Imaging and devices in lithographyINTEL CORP·Filed 2004·Granted Oct 21, 2008·0 cites·19 claims
- 3842US2007090084A1Reclaim method for extreme ultraviolet lithography mask blank and associated productsYAN PEI-YANG·Filed 2005·Application pending·0 cites
- 3941US2007002322A1Image inspection methodBORODOVSKY YAN·Filed 2005·Application pending·0 cites
- 4039US2005085085A1Composite patterning with trenchesFiled 2003·Application pending·0 cites
- 4138US2005088633A1Composite optical lithography method for patterning lines of unequal widthINTEL CORP·Filed 2003·Application pending·0 cites
- 4238US2007006113A1Determining an optimizaton for generating a pixelated photolithography mask with high resolution imaging capabilityHU BIN·Filed 2005·Application pending·0 cites
- 4338US2005074698A1Composite optical lithography method for patterning lines of significantly different widthsINTEL CORP·Filed 2003·Application pending·0 cites
- 4438US2005073671A1Composite optical lithography method for patterning lines of substantially equal widthINTEL CORP·Filed 2003·Application pending·0 cites
- 4530US4672420AIntegrated circuit structure having conductive, protective layer for multilayer metallization to permit reworkingADVANCED MICRO DEVICES INC·Filed 1985·Granted Jun 9, 1987·3 cites·6 claims
- 4630US4580332AForming a conductive, protective layer for multilayer metallizationADVANCED MICRO DEVICES INC·Filed 1984·Granted Apr 8, 1986·1 cites·10 claims
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