Inventor · disambiguated record
Tien-Lai Wang
Also filed as: WANG TIEN-LAI
3 granted patents·7 pending applications·80 citations·filing 2001–2024
62Inventor score
Top patents by PatentIndex Score
10 records- 0182US6477045B1Heat dissipater for a central processing unitWANG TIEN-LAI·Filed 2001·Granted Nov 5, 2002·80 cites·19 claims
- 0261US2025323338A1Liquid-cooling heat dissipation plate and the lithium battery module containing the sameTOP RANK TECH LIMITED·Filed 2024·Application pending·0 cites
- 0355US2025324539A1Liquid cooling heat dissipation systemTOP RANK TECH LIMITED·Filed 2024·Application pending·0 cites
- 0454US12504236B2Liquid cooling vapor chamber heat dissipation moduleTOP RANK TECH LIMITED·Filed 2024·Granted Dec 23, 2025·0 cites·14 claims
- 0550US12320593B2Integrated vapor chamberTOP RANK TECH LIMITED·Filed 2023·Granted Jun 3, 2025·0 cites·12 claims
- 0649US2024298425A1Integrated heat dissipation module structureTOP RANK TECH LIMITED·Filed 2023·Application pending·0 cites
- 0740US2022336314A1Chip module with heat dissipation device and manufacturing method thereofSMARIM GLOBAL CORP·Filed 2021·Application pending·0 cites
- 0840US2015281850A1Hybrid electrostatic headphone moduleWANG TIEN-LAI·Filed 2014·Application pending·0 cites
- 0932US2017142520A1Hybrid electrostatic headphone moduleVERISONIX CORP·Filed 2016·Application pending·0 cites
- 1025US2003121645A1Heat dissipater for a central processing unitFiled 2001·Application pending·0 cites
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