Inventor · disambiguated record
Kazuyuki Ikura
Also filed as: IKURA KAZUYUKI
9 granted patents·1 pending application·22 citations·filing 2005–2011
82Inventor score
Top patents by PatentIndex Score
10 records- 0174US7513032B2Method of mounting an electronic part to a substrateFUJITSU LTD·Filed 2005·Granted Apr 7, 2009·8 cites·2 claims
- 0272US8925188B2Component mounting apparatusNISHINO TORU·Filed 2010·Granted Jan 6, 2015·3 cites·8 claims
- 0371US7790499B2Observation apparatus and method for observing void in underfill resinFUJITSU LTD·Filed 2007·Granted Sep 7, 2010·6 cites·8 claims
- 0467US7905268B2Ultrasonic bonding apparatusFUJITSU LTD·Filed 2009·Granted Mar 15, 2011·2 cites·4 claims
- 0559US7823618B2Ultrasonic bonding apparatusFUJITSU LTD·Filed 2009·Granted Nov 2, 2010·2 cites·20 claims
- 0655US7938160B2Ultrasonic bonding apparatusFUJITSU LTD·Filed 2009·Granted May 10, 2011·1 cites·9 claims
- 0744US2010024667A1Pressure-heating apparatus and methodFUJITSU LTD·Filed 2009·Application pending·0 cites
- 0837US8769810B2Part mounting methodNISHINO TORU·Filed 2010·Granted Jul 8, 2014·0 cites·7 claims
- 0934US8431052B2Manufacturing apparatus and method for optical waveguide structureIKURA KAZUYUKI·Filed 2011·Granted Apr 30, 2013·0 cites·5 claims
- 1032US8065793B2Method of encapsulating an electronic componentIKURA KAZUYUKI·Filed 2009·Granted Nov 29, 2011·0 cites·6 claims
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