Inventor · disambiguated record
Shriram Ramanathan
Also filed as: RAMANATHAN SHRIRAM
47 granted patents·27 pending applications·1,635 citations·filing 2003–2025
98Inventor score
Files withINTEL CORP32RAMANATHAN SHRIRAM14PURDUE RESEARCH FOUNDATION7HARVARD COLLEGE5KOBRINSKY MAURO J2
Top patents by PatentIndex Score
74 records- 0199US7410884B23D integrated circuits using thick metal for backside connections and offset bumpsINTEL CORP·Filed 2005·Granted Aug 12, 2008·278 cites·25 claims
- 0298US7345479B2Portable NMR device and method for making and using the sameINTEL CORP·Filed 2005·Granted Mar 18, 2008·62 cites·53 claims
- 0398US7274191B2Integrated on-chip NMR and ESR device and method for making and using the sameINTEL CORP·Filed 2005·Granted Sep 25, 2007·62 cites·72 claims
- 0498US6946384B2Stacked device underfill and a method of fabricationINTEL CORP·Filed 2003·Granted Sep 20, 2005·235 cites·23 claims
- 0597US7307005B2Wafer bonding with highly compliant plate having filler material enclosed hollow coreINTEL CORP·Filed 2004·Granted Dec 11, 2007·226 cites·6 claims
- 0697US7087538B2Method to fill the gap between coupled wafersINTEL CORP·Filed 2004·Granted Aug 8, 2006·237 cites·63 claims
- 0796US7320928B2Method of forming a stacked device fillerINTEL CORP·Filed 2003·Granted Jan 22, 2008·227 cites·13 claims
- 0893US8421225B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2012·Granted Apr 16, 2013·14 cites·8 claims
- 0992US6919231B1Methods of forming channels on an integrated circuit die and die cooling systems including such channelsINTEL CORP·Filed 2004·Granted Jul 19, 2005·56 cites·14 claims
- 1089US7183648B2Method and apparatus for low temperature copper to copper bondingINTEL CORP·Filed 2004·Granted Feb 27, 2007·43 cites·5 claims
- 1188US7750487B2Metal-metal bonding of compliant interconnectINTEL CORP·Filed 2004·Granted Jul 6, 2010·41 cites·14 claims
- 1287US7973407B2Three-dimensional stacked substrate arrangementsINTEL CORP·Filed 2008·Granted Jul 5, 2011·12 cites·12 claims
- 1386US7358201B2Methods of forming channels on an integrated circuit die and die cooling systems including such channelsINTEL CORP·Filed 2005·Granted Apr 15, 2008·11 cites·8 claims
- 1483US7692310B2Forming a hybrid deviceINTEL CORP·Filed 2006·Granted Apr 6, 2010·11 cites·20 claims
- 1580US8203208B2Three-dimensional stacked substrate arrangementsRAMANATHAN SHRIRAM·Filed 2011·Granted Jun 19, 2012·4 cites·7 claims
- 1679US8864957B2Vanadium oxide thin filmsRAMANATHAN SHRIRAM·Filed 2009·Granted Oct 21, 2014·6 cites·9 claims
- 1778US8541876B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2005·Granted Sep 24, 2013·7 cites·19 claims
- 1878US7402509B2Method of forming self-passivating interconnects and resulting devicesINTEL CORP·Filed 2005·Granted Jul 22, 2008·5 cites·32 claims
- 1975US9508675B2Microelectronic package having direct contact heat spreader and method of manufacturing sameLU DAOQIANG·Filed 2013·Granted Nov 29, 2016·3 cites·27 claims
- 2075US7800371B2Portable NMR device and method for making and using the sameINTEL CORP·Filed 2007·Granted Sep 21, 2010·3 cites·11 claims
- 2174US7723759B2Stacked wafer or die packaging with enhanced thermal and device performanceINTEL CORP·Filed 2005·Granted May 25, 2010·6 cites·11 claims
- 2272US7537954B2Microelectronic assembly having thermoelectric elements to cool a die and a method of making the sameINTEL CORP·Filed 2005·Granted May 26, 2009·4 cites·12 claims
- 2370US7118989B2Method of forming vias on a wafer stack using laser ablationINTEL CORP·Filed 2004·Granted Oct 10, 2006·13 cites·7 claims
- 2469US10600959B2Dopant-driven phase transitions in correlated metal oxidesHARVARD COLLEGE·Filed 2014·Granted Mar 24, 2020·3 cites·14 claims
- 2569US7034394B2Microelectronic assembly having thermoelectric elements to cool a die and a method of making the sameINTEL CORP·Filed 2003·Granted Apr 25, 2006·12 cites·27 claims
- 2669US2025270613A1Ultralow concentration sensing of bio-matter with perovskite nickelate devices and arraysPURDUE RESEARCH FOUNDATION·Filed 2025·Application pending·0 cites
- 2768US8512559B2Device, method, and system for separation and detection of biomolecules and cellsRAMANATHAN SHRIRAM·Filed 2005·Granted Aug 20, 2013·2 cites·29 claims
- 2867US8076662B2Electric field induced phase transitions and dynamic tuning of the properties of oxide structuresRAMANATHAN SHRIRAM·Filed 2009·Granted Dec 13, 2011·8 cites·12 claims
- 2964US6984873B2Method of forming a stacked device fillerINTEL CORP·Filed 2003·Granted Jan 10, 2006·11 cites·8 claims
- 3061US12338482B2Ultralow concentration sensing of bio-matter with perovskite nickelate devices and arraysPURDUE RESEARCH FOUNDATION·Filed 2019·Granted Jun 24, 2025·0 cites·7 claims
- 3161US7663230B2Methods of forming channels on an integrated circuit die and die cooling systems including such channelsINTEL CORP·Filed 2008·Granted Feb 16, 2010·1 cites·4 claims
- 3260US7268015B2Method for wafer stacking using copper structures of substantially uniform heightINTEL CORP·Filed 2006·Granted Sep 11, 2007·1 cites·11 claims
- 3358US7186637B2Method of bonding semiconductor devicesINTEL CORP·Filed 2003·Granted Mar 6, 2007·7 cites·18 claims
- 3457US12174167B2Microstructurally engineered perovskite gas sensorPURDUE RESEARCH FOUNDATION·Filed 2020·Granted Dec 24, 2024·0 cites·18 claims
- 3557US2014008281A1Device, method, and system for separation and detection of biomolecules and cellsINTEL CORP·Filed 2013·Application pending·0 cites
- 3656US2010227083A1Nanoscale Oxide CoatingsHARVARD COLLEGE·Filed 2007·Application pending·0 cites
- 3755US7589417B2Microelectronic assembly having thermoelectric elements to cool a die and a method of making the sameINTEL CORP·Filed 2004·Granted Sep 15, 2009·8 cites·11 claims
- 3855US7214605B2Deposition of diffusion barrierINTEL CORP·Filed 2003·Granted May 8, 2007·6 cites·8 claims
- 3954US11385376B2Electric field sensing devices and systems and method of making the samePURDUE RESEARCH FOUNDATION·Filed 2018·Granted Jul 12, 2022·0 cites·21 claims
- 4053US9620803B2Solid oxide fuel cell with reinforced electrolyte membraneRAMANATHAN SHRIRAM·Filed 2015·Granted Apr 11, 2017·0 cites·20 claims
- 4153US7038324B2Wafer stacking using interconnect structures of substantially uniform heightINTEL CORP·Filed 2004·Granted May 2, 2006·4 cites·14 claims
- 4252US12092936B2Porous perovskite nickelates with enhanced electrochromic properties and systems thereofPURDUE RESEARCH FOUNDATION·Filed 2020·Granted Sep 17, 2024·0 cites·25 claims
- 4351US8815466B2Micro-scale energy conversion devices and methodsRAMANATHAN SHRIRAM·Filed 2008·Granted Aug 26, 2014·0 cites·40 claims
- 4451US2011181345A1Phase transition devices and smart capacitive devicesHARVARD COLLEGE·Filed 2009·Application pending·0 cites
- 4549US2021255518A1Multi-layer optical materials systems and methods of making the samePURDUE RESEARCH FOUNDATION·Filed 2019·Application pending·0 cites
- 4649US2010255387A1Photo-activation of solid oxide fuel cells and gas separation devicesHARVARD COLLEGE·Filed 2007·Application pending·0 cites
- 4749US2013256122A1Electrochemically functional membranesRAMANATHAN SHRIRAM·Filed 2011·Application pending·0 cites
- 4848US8030782B2Metal-metal bonding of compliant interconnectINTEL CORP·Filed 2010·Granted Oct 4, 2011·0 cites·10 claims
- 4948US7180180B2Stacked device underfill and a method of fabricationINTEL CORP·Filed 2004·Granted Feb 20, 2007·2 cites·20 claims
- 5048US2007287263A1Highly compliant plate for wafer bondingKOBRINSKY MAURO J·Filed 2007·Application pending·0 cites
Showing the top 50 of 74 patent records by PatentIndex Score.
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