Inventor · disambiguated record
Mihir K. Roy
Also filed as: ROY MIHIR · ROY MIHIR K
59 granted patents·13 pending applications·260 citations·filing 2006–2024
98Inventor score
Top patents by PatentIndex Score
72 records- 0199US8866308B2High density interconnect device and methodINTEL CORP·Filed 2012·Granted Oct 21, 2014·50 cites·19 claims
- 0297US9210809B2Reduced PTH pad for enabling core routing and substrate layer count reductionMALLIK DEBENDRA·Filed 2013·Granted Dec 8, 2015·37 cites·13 claims
- 0396US10163557B2Helical plated through-hole package inductorINTEL CORP·Filed 2015·Granted Dec 25, 2018·6 cites·9 claims
- 0495US9548264B2High density organic bridge device and methodINTEL CORP·Filed 2016·Granted Jan 17, 2017·10 cites·20 claims
- 0593US9917044B2Package with bi-layered dielectric structureINTEL CORP·Filed 2015·Granted Mar 13, 2018·12 cites·25 claims
- 0693US9704735B2Dual side solder resist layers for coreless packages and packages with an embedded interconnect bridge and their methods of fabricationKONCHADY MANOHAR S·Filed 2014·Granted Jul 11, 2017·21 cites·25 claims
- 0791US9236366B2High density organic bridge device and methodINTEL CORP·Filed 2012·Granted Jan 12, 2016·14 cites·18 claims
- 0889US10998120B2Method of making an inductorINTEL CORP·Filed 2018·Granted May 4, 2021·1 cites·14 claims
- 0989US2024421098A1High density interconnect device and methodTAHOE RES LTD·Filed 2024·Application pending·0 cites
- 1087US10629469B2Solder resist layers for coreless packages and methods of fabricationINTEL CORP·Filed 2017·Granted Apr 21, 2020·4 cites·4 claims
- 1187US10446499B2High density interconnect device and methodINTEL CORP·Filed 2017·Granted Oct 15, 2019·3 cites·6 claims
- 1287US8928151B2Hybrid core through holes and viasINTEL CORP·Filed 2013·Granted Jan 6, 2015·7 cites·14 claims
- 1386US8552564B2Hybrid-core through holes and viasROY MIHIR K·Filed 2010·Granted Oct 8, 2013·7 cites·23 claims
- 1486US2024321762A1High density organic bridge device and methodINTEL CORP·Filed 2024·Application pending·0 cites
- 1585US8952540B2In situ-built pin-grid arrays for coreless substrates, and methods of making sameROY MIHIR K·Filed 2011·Granted Feb 10, 2015·7 cites·24 claims
- 1684US12094831B2High density interconnect device and methodTAHOE RES LTD·Filed 2023·Granted Sep 17, 2024·0 cites·20 claims
- 1784US11942391B2System in package with flip chip die over multi-layer heatsink stanchionQORVO US INC·Filed 2021·Granted Mar 26, 2024·1 cites·25 claims
- 1884US11637050B2Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2021·Granted Apr 25, 2023·1 cites·20 claims
- 1984US8440506B2Microelectronic package and method for a compression-based mid-level interconnectROBERTS BRENT M·Filed 2012·Granted May 14, 2013·9 cites·20 claims
- 2083US8617990B2Reduced PTH pad for enabling core routing and substrate layer count reductionMALLIK DEBENDRA·Filed 2010·Granted Dec 31, 2013·5 cites·5 claims
- 2183US8278214B2Through mold via polymer block packageROY MIHIR K·Filed 2009·Granted Oct 2, 2012·10 cites·8 claims
- 2281US10103105B2High density organic bridge device and methodINTEL CORP·Filed 2016·Granted Oct 16, 2018·2 cites·20 claims
- 2380US11443970B2Methods of forming a package substrateINTEL CORP·Filed 2020·Granted Sep 13, 2022·1 cites·7 claims
- 2480US9899311B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2016·Granted Feb 20, 2018·2 cites·22 claims
- 2580US9198293B2Non-cylindrical conducting shapes in multilayer laminated substrate coresCHASE HAROLD R·Filed 2013·Granted Nov 24, 2015·8 cites·20 claims
- 2680US8227706B2Coaxial plated through holes (PTH) for robust electrical performanceROY MIHIR·Filed 2008·Granted Jul 24, 2012·12 cites·10 claims
- 2779US10672713B2High density organic bridge device and methodINTEL CORP·Filed 2018·Granted Jun 2, 2020·1 cites·22 claims
- 2879US10085341B2Direct chip attach using embedded tracesINTEL CORP·Filed 2017·Granted Sep 25, 2018·2 cites·10 claims
- 2979US9633938B2Hybrid pitch package with ultra high density interconnect capabilityINTEL CORP·Filed 2015·Granted Apr 25, 2017·2 cites·22 claims
- 3079US2024379487A1Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2024·Application pending·0 cites
- 3178US11664320B2High density interconnect device and methodTAHOE RES LTD·Filed 2021·Granted May 30, 2023·0 cites·18 claims
- 3278US11608564B2Helical plated through-hole package inductorINTEL CORP·Filed 2021·Granted Mar 21, 2023·0 cites·13 claims
- 3377US12087656B2Package architecture utilizing wafer to wafer bondingQORVO US INC·Filed 2023·Granted Sep 10, 2024·0 cites·23 claims
- 3477US8278752B2Microelectronic package and method for a compression-based mid-level interconnectROBERTS BRENT M·Filed 2009·Granted Oct 2, 2012·7 cites·12 claims
- 3576US10312007B2Inductor formed in substrateINTEL CORP·Filed 2012·Granted Jun 4, 2019·3 cites·11 claims
- 3675US9521751B2Weaved electrical components in a substrate package coreINTEL CORP·Filed 2013·Granted Dec 13, 2016·2 cites·21 claims
- 3773US12002762B2High density organic bridge device and methodINTEL CORP·Filed 2020·Granted Jun 4, 2024·0 cites·19 claims
- 3871US12334413B2System in package with flip chip die over multi-layer heatsink stanchionQORVO US INC·Filed 2024·Granted Jun 17, 2025·0 cites·24 claims
- 3970US9406587B2Substrate conductor structure and methodCHASE HAROLD RYAN·Filed 2012·Granted Aug 2, 2016·2 cites·14 claims
- 4068US9622350B2Method of forming a circuit boardROY MIHIR K·Filed 2013·Granted Apr 11, 2017·1 cites·12 claims
- 4168US9526175B2Suspended inductor microelectronic structuresMANUSHAROW MATHEW J·Filed 2012·Granted Dec 20, 2016·2 cites·14 claims
- 4268US8389337B2Patch on interposer assembly and structures formed therebyROBERTS BRENT M·Filed 2009·Granted Mar 5, 2013·3 cites·15 claims
- 4367US11158578B2High density interconnect device and methodINTEL CORP·Filed 2019·Granted Oct 26, 2021·0 cites·8 claims
- 4466US10410939B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2015·Granted Sep 10, 2019·1 cites·25 claims
- 4562US9552977B2Landside stiffening capacitors to enable ultrathin and other low-Z productsINTEL CORP·Filed 2012·Granted Jan 24, 2017·1 cites·15 claims
- 4661US9999129B2Microelectronic device and method of manufacturing sameGUZEK JOHN S·Filed 2009·Granted Jun 12, 2018·2 cites·9 claims
- 4761US9275975B2Electronic package and method of connecting a first die to a second die to form an electronic packageCHASE HAROLD RYAN·Filed 2014·Granted Mar 1, 2016·1 cites·9 claims
- 4860US10734282B2Substrate conductor structure and methodINTEL CORP·Filed 2018·Granted Aug 4, 2020·0 cites·11 claims
- 4959US10971416B2Package power delivery using plane and shaped viasINTEL CORP·Filed 2019·Granted Apr 6, 2021·0 cites·16 claims
- 5059US2015035144A1High density interconnect device and methodROY MIHIR K·Filed 2014·Application pending·0 cites
Showing the top 50 of 72 patent records by PatentIndex Score.
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