Inventor · disambiguated record
Michael Joseph Klodowski
Also filed as: KLODOWSKI MICHAEL J · KLODOWSKI MICHAEL JOSEPH
21 granted patents·1 pending application·843 citations·filing 1996–2007
96Inventor score
Top patents by PatentIndex Score
22 records- 0198US6902869B2Manufacturing methods for printed circuit boardsIBM·Filed 2003·Granted Jun 7, 2005·156 cites·15 claims
- 0296US6222136B1Printed circuit board with continuous connective bumpsIBM·Filed 1997·Granted Apr 24, 2001·131 cites·13 claims
- 0392US6015520AMethod for filling holes in printed wiring boardsIBM·Filed 1997·Granted Jan 18, 2000·84 cites·27 claims
- 0488US6214525B1Printed circuit board with circuitized cavity and methods of producing sameIBM·Filed 1999·Granted Apr 10, 2001·105 cites·38 claims
- 0587US6503821B2Integrated circuit chip carrier assemblyIBM·Filed 2001·Granted Jan 7, 2003·39 cites·30 claims
- 0687US5981312AMethod for injection molded flip chip encapsulationIBM·Filed 1997·Granted Nov 9, 1999·72 cites·12 claims
- 0786US6329713B1Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrateIBM·Filed 1998·Granted Dec 11, 2001·68 cites·33 claims
- 0878US6675852B2Platen for use in laminating pressIBM·Filed 2001·Granted Jan 13, 2004·14 cites·9 claims
- 0977US6684497B2Manufacturing methods for printed circuit boardsIBM·Filed 2001·Granted Feb 3, 2004·16 cites·14 claims
- 1076US5784782AMethod for fabricating printed circuit boards with cavitiesIBM·Filed 1996·Granted Jul 28, 1998·44 cites·18 claims
- 1175US7059049B2Electronic package with optimized lamination processIBM·Filed 2002·Granted Jun 13, 2006·15 cites·14 claims
- 1270US6395998B1Electronic package having an adhesive retaining cavityIBM·Filed 2000·Granted May 28, 2002·18 cites·23 claims
- 1368US6570261B2Method and apparatus for injection molded flip chip encapsulationIBM·Filed 2002·Granted May 27, 2003·11 cites·5 claims
- 1467US7240430B2Manufacturing methods for printed circuit boardsIBM·Filed 2005·Granted Jul 10, 2007·2 cites·7 claims
- 1566US6066386APrinted circuit board with cavity for circuitizationIBM·Filed 1998·Granted May 23, 2000·27 cites·9 claims
- 1664US6369449B2Method and apparatus for injection molded flip chip encapsulationIBM·Filed 1999·Granted Apr 9, 2002·23 cites·5 claims
- 1762US7329816B2Electronic package with optimized lamination processIBM·Filed 2005·Granted Feb 12, 2008·2 cites·9 claims
- 1851US6843929B1Accelerated etching of chromiumIBM·Filed 2000·Granted Jan 18, 2005·3 cites·20 claims
- 1948US2008022519A1Electronic package with optimized lamination processFARQUHAR DONALD S·Filed 2007·Application pending·0 cites
- 2047US6335495B1Patterning a layered chrome-copper structure disposed on a dielectric substrateIBM·Filed 1999·Granted Jan 1, 2002·11 cites·10 claims
- 2145US7063756B2Enhanced design and process for a conductive adhesiveIBM·Filed 2003·Granted Jun 20, 2006·2 cites·17 claims
- 2225US6534724B1Enhanced design and process for a conductive adhesiveIBM·Filed 1997·Granted Mar 18, 2003·0 cites·2 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →