Inventor · disambiguated record
Donald S. Farquhar
Also filed as: FARQUHAR DONALD · FARQUHAR DONALD S · FARQUHAR DONALD SETON
82 granted patents·9 pending applications·2,615 citations·filing 1996–2022
99Inventor score
Top patents by PatentIndex Score
91 records- 0198US7301108B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2004·Granted Nov 27, 2007·105 cites·10 claims
- 0298US6902869B2Manufacturing methods for printed circuit boardsIBM·Filed 2003·Granted Jun 7, 2005·156 cites·15 claims
- 0397US6931726B2Method of making and interconnect structureIBM·Filed 2003·Granted Aug 23, 2005·91 cites·3 claims
- 0497US6465084B1Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2001·Granted Oct 15, 2002·116 cites·12 claims
- 0596US8674377B2Optoelectronic device package, array and method of fabricationFARQUHAR DONALD SETON·Filed 2011·Granted Mar 18, 2014·29 cites·18 claims
- 0696US6929900B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2003·Granted Aug 16, 2005·127 cites·6 claims
- 0796US6222136B1Printed circuit board with continuous connective bumpsIBM·Filed 1997·Granted Apr 24, 2001·131 cites·13 claims
- 0895US6686539B2Tamper-responding encapsulated enclosure having flexible protective mesh structureIBM·Filed 2001·Granted Feb 3, 2004·109 cites·17 claims
- 0995US6600224B1Thin film attachment to laminate using a dendritic interconnectionIBM·Filed 2000·Granted Jul 29, 2003·83 cites·19 claims
- 1095US6373717B1Electronic package with high density interconnect layerIBM·Filed 2000·Granted Apr 16, 2002·97 cites·16 claims
- 1192US6826830B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2002·Granted Dec 7, 2004·42 cites·15 claims
- 1292US6015520AMethod for filling holes in printed wiring boardsIBM·Filed 1997·Granted Jan 18, 2000·84 cites·27 claims
- 1391US6638607B1Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2002·Granted Oct 28, 2003·40 cites·9 claims
- 1489US10168288B2System for radiography imaging and method of operating such systemGEN ELECTRIC·Filed 2015·Granted Jan 1, 2019·10 cites·20 claims
- 1589US8344389B2Optoelectronic device arrayGEN ELECTRIC·Filed 2010·Granted Jan 1, 2013·9 cites·22 claims
- 1689US5847324AHigh performance electrical cableIBM·Filed 1996·Granted Dec 8, 1998·65 cites·8 claims
- 1788US6399896B1Circuit package having low modulus, conformal mounting padsIBM·Filed 2000·Granted Jun 4, 2002·51 cites·12 claims
- 1888US6214525B1Printed circuit board with circuitized cavity and methods of producing sameIBM·Filed 1999·Granted Apr 10, 2001·105 cites·38 claims
- 1988US5900675AOrganic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion ratesIBM·Filed 1997·Granted May 4, 1999·93 cites·20 claims
- 2087US6503821B2Integrated circuit chip carrier assemblyIBM·Filed 2001·Granted Jan 7, 2003·39 cites·30 claims
- 2187US6504111B2Solid via layer to layer interconnectIBM·Filed 2001·Granted Jan 7, 2003·29 cites·16 claims
- 2287US5981312AMethod for injection molded flip chip encapsulationIBM·Filed 1997·Granted Nov 9, 1999·72 cites·12 claims
- 2386US7679921B2Security cloth design and assemblyIBM·Filed 2005·Granted Mar 16, 2010·18 cites·12 claims
- 2486US6982642B1Security cloth design and assemblyIBM·Filed 2000·Granted Jan 3, 2006·34 cites·8 claims
- 2586US6645607B2Method and structure for producing Z-axis interconnection assembly of printed wiring board elementsIBM·Filed 2002·Granted Nov 11, 2003·24 cites·14 claims
- 2686US6639155B1High performance packaging platform and method of making sameIBM·Filed 1997·Granted Oct 28, 2003·62 cites·13 claims
- 2786US6329713B1Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrateIBM·Filed 1998·Granted Dec 11, 2001·68 cites·33 claims
- 2885US6829823B2Method of making a multi-layered interconnect structureIBM·Filed 2002·Granted Dec 14, 2004·31 cites·25 claims
- 2984US6764748B1Z-interconnections with liquid crystal polymer dielectric filmsIBM·Filed 2003·Granted Jul 20, 2004·48 cites·10 claims
- 3083US6426470B1Formation of multisegmented plated through holesIBM·Filed 2001·Granted Jul 30, 2002·23 cites·15 claims
- 3182US8450926B2OLED lighting devices including electrodes with magnetic materialROBERTS BRUCE R·Filed 2009·Granted May 28, 2013·9 cites·20 claims
- 3281US8350470B2Encapsulation structures of organic electroluminescence devicesGEN ELECTRIC·Filed 2008·Granted Jan 8, 2013·6 cites·15 claims
- 3381US5925206APractical method to make blind vias in circuit boards and other substratesIBM·Filed 1997·Granted Jul 20, 1999·63 cites·14 claims
- 3480US6254972B1Semiconductor device having a thermoset-containing dielectric material and methods for fabricating the sameIBM·Filed 1999·Granted Jul 3, 2001·29 cites·11 claims
- 3579US6079100AMethod of making a printed circuit board having filled holes and fill member for use therewithIBM·Filed 1998·Granted Jun 27, 2000·48 cites·25 claims
- 3678US6700078B2Formation of multisegmented plated through holesIBM·Filed 2002·Granted Mar 2, 2004·17 cites·11 claims
- 3778US6675852B2Platen for use in laminating pressIBM·Filed 2001·Granted Jan 13, 2004·14 cites·9 claims
- 3877US6684497B2Manufacturing methods for printed circuit boardsIBM·Filed 2001·Granted Feb 3, 2004·16 cites·14 claims
- 3976US8102119B2Encapsulated optoelectronic device and method for making the sameFARQUHAR DONALD SETON·Filed 2009·Granted Jan 24, 2012·5 cites·12 claims
- 4076US7981245B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2007·Granted Jul 19, 2011·4 cites·11 claims
- 4176US7777136B2Multi-layered interconnect structure using liquid crystalline polymer dielectricIBM·Filed 2007·Granted Aug 17, 2010·5 cites·11 claims
- 4276US6501171B2Flip chip package with improved cap design and process for making thereofIBM·Filed 2001·Granted Dec 31, 2002·24 cites·36 claims
- 4376US5784782AMethod for fabricating printed circuit boards with cavitiesIBM·Filed 1996·Granted Jul 28, 1998·44 cites·18 claims
- 4475US7059049B2Electronic package with optimized lamination processIBM·Filed 2002·Granted Jun 13, 2006·15 cites·14 claims
- 4575US7007171B1Method and apparatus for improved fold retention on a security enclosureIBM·Filed 2000·Granted Feb 28, 2006·32 cites·29 claims
- 4674US6552263B2Method of injection molded flip chip encapsulationIBM·Filed 2002·Granted Apr 22, 2003·18 cites·14 claims
- 4773US8137148B2Method of manufacturing monolithic parallel interconnect structureFARQUHAR DONALD SETON·Filed 2009·Granted Mar 20, 2012·4 cites·10 claims
- 4873US6407461B1Injection molded integrated circuit chip assemblyIBM·Filed 1997·Granted Jun 18, 2002·37 cites·5 claims
- 4972US6967705B2Lamination of liquid crystal polymer dielectric filmsIBM·Filed 2004·Granted Nov 22, 2005·6 cites·14 claims
- 5071US9406470B2Tri-stable flexure mechanismGEN ELECTRIC·Filed 2014·Granted Aug 2, 2016·2 cites·17 claims
Showing the top 50 of 91 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →