Inventor · disambiguated record
Ker-Hsun Liao
Also filed as: LIAO KER-HSUN
6 granted patents·4 pending applications·2 citations·filing 2013–2025
68Inventor score
Top patents by PatentIndex Score
10 records- 0191US12000455B2Systems and methods for reducing vibration of apparatusesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 4, 2024·2 cites·20 claims
- 0281US2025364222A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0375US2024278295A1Method of cleaning, support, and cleaning apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0474US2024384403A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0572US11986869B2Method of cleaning, support, and cleaning apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·19 claims
- 0671US12505987B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 23, 2025·0 cites·20 claims
- 0770US2024247700A1Methods for reducing vibration of semiconductor manufacturing apparatuses and semiconductor manufacturing apparatusesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0865US12084762B2Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 0947US9373529B2Process tool having third heating source and method of using the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 21, 2016·0 cites·20 claims
- 1041US9543141B2Method for curing flowable layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →