Inventor · disambiguated record
Bernd Karl Appelt
Also filed as: APPELT BERND K · APPELT BERND KARL · APPELT BERND KARL-HEINZ
95 granted patents·16 pending applications·1,549 citations·filing 1983–2025
99Inventor score
Top patents by PatentIndex Score
111 records- 0198US6902869B2Manufacturing methods for printed circuit boardsIBM·Filed 2003·Granted Jun 7, 2005·156 cites·15 claims
- 0297US11682656B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 20, 2023·4 cites·18 claims
- 0396US6222136B1Printed circuit board with continuous connective bumpsIBM·Filed 1997·Granted Apr 24, 2001·131 cites·13 claims
- 0496US6215649B1Printed circuit board capacitor structure and methodIBM·Filed 1998·Granted Apr 10, 2001·110 cites·4 claims
- 0595US10229892B2Semiconductor package and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 12, 2019·12 cites·35 claims
- 0695US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0794US10186467B2Semiconductor package device and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Jan 22, 2019·10 cites·20 claims
- 0894US4969979ADirect electroplating of through holesIBM·Filed 1989·Granted Nov 13, 1990·66 cites·18 claims
- 0993US11791245B2Electronic package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Oct 17, 2023·2 cites·18 claims
- 1093US10217728B2Semiconductor package and semiconductor processADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Feb 26, 2019·11 cites·47 claims
- 1192US8284561B2Embedded component package structureSU YUAN-CHANG·Filed 2010·Granted Oct 9, 2012·16 cites·19 claims
- 1292US7199438B2Overmolded optical packageADVANCED SEMICONDUCTOR ENG·Filed 2003·Granted Apr 3, 2007·61 cites·7 claims
- 1392US6015520AMethod for filling holes in printed wiring boardsIBM·Filed 1997·Granted Jan 18, 2000·84 cites·27 claims
- 1491US8884424B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·12 cites·17 claims
- 1591US8304878B2Embedded component substrate, semiconductor package structure using the same and fabrication methods thereofAPPELT BERND KARL·Filed 2010·Granted Nov 6, 2012·16 cites·19 claims
- 1689US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 1788US5900675AOrganic controlled collapse chip connector (C4) ball grid array (BGA) chip carrier with dual thermal expansion ratesIBM·Filed 1997·Granted May 4, 1999·93 cites·20 claims
- 1886US11322428B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted May 3, 2022·4 cites·12 claims
- 1986US6734569B2Die attachment with reduced adhesive bleed-outIBM·Filed 2002·Granted May 11, 2004·42 cites·12 claims
- 2085US8487426B2Semiconductor package with embedded die and manufacturing methods thereofESSIG KAY STEPHAN·Filed 2011·Granted Jul 16, 2013·14 cites·20 claims
- 2184US12009317B2Semiconductor package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Jun 11, 2024·1 cites·9 claims
- 2284US8399776B2Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and packageAPPELT BERND KARL·Filed 2009·Granted Mar 19, 2013·16 cites·40 claims
- 2382US6815085B2Printed circuit board capacitor structure and methodIBM·Filed 2003·Granted Nov 9, 2004·22 cites·11 claims
- 2481US11545406B2Substrate structure, semiconductor package structure and method for manufacturing a substrate structureADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Jan 3, 2023·1 cites·8 claims
- 2581US4479983AMethod and composition for applying coatings on printed circuit boardsIBM·Filed 1983·Granted Oct 30, 1984·31 cites·25 claims
- 2679US11145624B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 12, 2021·2 cites·21 claims
- 2779US6207595B1Laminate and method of manufacture thereofIBM·Filed 1998·Granted Mar 27, 2001·59 cites·8 claims
- 2878US10978312B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Apr 13, 2021·2 cites·45 claims
- 2977US6684497B2Manufacturing methods for printed circuit boardsIBM·Filed 2001·Granted Feb 3, 2004·16 cites·14 claims
- 3076US7417313B2Method for manufacturing an adhesive substrate with a die-cavity sidewallADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Aug 26, 2008·5 cites·11 claims
- 3176US6391210B2Process for manufacturing a multi-layer circuit boardIBM·Filed 2001·Granted May 21, 2002·17 cites·21 claims
- 3275US6387205B1Dustfree prepreg and method for making an article based thereonIBM·Filed 2000·Granted May 14, 2002·16 cites·12 claims
- 3374US6555762B2Electronic package having substrate with electrically conductive through holes filled with polymer and conductive compositionIBM·Filed 1999·Granted Apr 29, 2003·38 cites·3 claims
- 3473US7344915B2Method for manufacturing a semiconductor package with a laminated chip cavityADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted Mar 18, 2008·7 cites·22 claims
- 3573US5305186APower carrier with selective thermal performanceIBM·Filed 1993·Granted Apr 19, 1994·48 cites·16 claims
- 3672US11282777B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 22, 2022·1 cites·23 claims
- 3772US2025246514A1Electronic package and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 3871US9196597B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 24, 2015·2 cites·18 claims
- 3971US8330267B2Semiconductor packageCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 11, 2012·5 cites·20 claims
- 4071US5981880AElectronic device packages having glass free non conductive layersIBM·Filed 1996·Granted Nov 9, 1999·33 cites·3 claims
- 4171US5189261AElectrical and/or thermal interconnections and methods for obtaining suchIBM·Filed 1990·Granted Feb 23, 1993·52 cites·9 claims
- 4268US11574856B2Semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Feb 7, 2023·0 cites·20 claims
- 4368US8104171B2Method of fabricating multi-layered substrateAPPELT BERND KARL·Filed 2008·Granted Jan 31, 2012·2 cites·13 claims
- 4467US7240430B2Manufacturing methods for printed circuit boardsIBM·Filed 2005·Granted Jul 10, 2007·2 cites·7 claims
- 4566US6574090B2Printed circuit board capacitor structure and methodIBM·Filed 2001·Granted Jun 3, 2003·9 cites·10 claims
- 4666US6252307B1Structure for preventing adhesive bleed onto surfacesIBM·Filed 2000·Granted Jun 26, 2001·12 cites·12 claims
- 4766US6114098AMethod of filling an aperture in a substrateIBM·Filed 1998·Granted Sep 5, 2000·25 cites·13 claims
- 4864US12283537B2Electronic package and method of forming the sameADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 22, 2025·0 cites·16 claims
- 4963US6625857B2Method of forming a capacitive elementIBM·Filed 2001·Granted Sep 30, 2003·8 cites·11 claims
- 5062US11735433B2Substrate structure, package structure and method for manufacturing electronic package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Aug 22, 2023·0 cites·18 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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