Inventor · disambiguated record
Kuang-Hsiung Chen
Also filed as: CHEN KUANG-HSIUNG
43 granted patents·7 pending applications·229 citations·filing 2003–2025
97Inventor score
Files withADVANCED SEMICONDUCTOR ENG34CHEN KUANG-HSIUNG6SU YUAN-CHANG2SUN YU-CHING2APPELT BERND KARL1
Top patents by PatentIndex Score
50 records- 0195US11276806B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2020·Granted Mar 15, 2022·4 cites·22 claims
- 0295US8569894B2Semiconductor package with single sided substrate design and manufacturing methods thereofSU YUAN-CHANG·Filed 2011·Granted Oct 29, 2013·27 cites·29 claims
- 0393US8076765B2Stackable semiconductor device packages including openings partially exposing connecting elements, conductive bumps, or conductive conductorsCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 13, 2011·52 cites·25 claims
- 0492US10157887B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Dec 18, 2018·9 cites·20 claims
- 0592US9171792B2Semiconductor device packages having a side-by-side device arrangement and stacking functionalitySUN YU-CHING·Filed 2011·Granted Oct 27, 2015·39 cites·19 claims
- 0691US8884424B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Nov 11, 2014·12 cites·17 claims
- 0789US10446411B2Semiconductor device package with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 15, 2019·5 cites·18 claims
- 0889US8288869B2Semiconductor package with substrate having single metal layer and manufacturing methods thereofHUANG SHIH-FU·Filed 2010·Granted Oct 16, 2012·15 cites·20 claims
- 0988US8367473B2Substrate having single patterned metal layer exposing patterned dielectric layer, chip package structure including the substrate, and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 5, 2013·12 cites·18 claims
- 1087US2025334402A1Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2025·Application pending·0 cites
- 1186US10573624B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Feb 25, 2020·4 cites·19 claims
- 1286US10049893B2Semiconductor device with a conductive postADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Aug 14, 2018·4 cites·23 claims
- 1385US12352602B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2023·Granted Jul 8, 2025·0 cites·13 claims
- 1485US10134683B2Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Nov 20, 2018·6 cites·21 claims
- 1585US8786062B2Semiconductor package and process for fabricating sameSU YUAN-CHANG·Filed 2010·Granted Jul 22, 2014·8 cites·6 claims
- 1678US11835363B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2022·Granted Dec 5, 2023·0 cites·11 claims
- 1777US10224298B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted Mar 5, 2019·2 cites·19 claims
- 1873US9984989B2Semiconductor substrate and semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 29, 2018·2 cites·13 claims
- 1973US8143101B2Semiconductor package and the method of making the sameSUN YU-CHING·Filed 2008·Granted Mar 27, 2012·10 cites·21 claims
- 2071US10515884B2Substrate having a conductive structure within photo-sensitive resinADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 24, 2019·2 cites·25 claims
- 2171US9196597B2Semiconductor package with single sided substrate design and manufacturing methods thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Nov 24, 2015·2 cites·18 claims
- 2271US8330267B2Semiconductor packageCHEN KUANG-HSIUNG·Filed 2009·Granted Dec 11, 2012·5 cites·20 claims
- 2369US9165900B2Semiconductor package and process for fabricating sameADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Oct 20, 2015·2 cites·20 claims
- 2466US11262197B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 1, 2022·0 cites·18 claims
- 2565US8779581B2Heat dissipating semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Granted Jul 15, 2014·2 cites·12 claims
- 2664US9911702B2Semiconductor package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Mar 6, 2018·1 cites·24 claims
- 2761US9054118B2Heat dissipating semiconductor device packages and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Jun 9, 2015·1 cites·20 claims
- 2860US8309400B2Leadframe package structure and manufacturing method thereofAPPELT BERND KARL·Filed 2010·Granted Nov 13, 2012·1 cites·21 claims
- 2957US10734337B2Semiconductor package device having glass transition temperature greater than binding layer temperatureADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Aug 4, 2020·0 cites·16 claims
- 3056US10508910B2Optical module and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 17, 2019·0 cites·27 claims
- 3155US11631633B2Substrate structure, semiconductor package structure and method for manufacturing semiconductor package structureADVANCED SEMICONDUCTOR ENG·Filed 2021·Granted Apr 18, 2023·0 cites·9 claims
- 3254US10103110B2Semiconductor package structure and fabrication method thereofADVANCED SEMICONDUCTOR ENG·Filed 2018·Granted Oct 16, 2018·0 cites·25 claims
- 3352US2024297090A1Package structureADVANCED SEMICONDUCTOR ENG·Filed 2023·Application pending·0 cites
- 3451US7927924B2Semi-finished package and method for making a packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Apr 19, 2011·1 cites·11 claims
- 3547US11600567B2Semiconductor device package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Mar 7, 2023·0 cites·13 claims
- 3645US11139225B2Device including a plurality of leads surrounding a die paddle and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2019·Granted Oct 5, 2021·0 cites·22 claims
- 3745US8058725B2Package structure and package substrate thereofCHEN KUANG-HSIUNG·Filed 2007·Granted Nov 15, 2011·1 cites·16 claims
- 3844US2012049338A1Stackable semiconductor device packagesCHEN KUANG-HSIUNG·Filed 2011·Application pending·0 cites
- 3943US10049976B2Semiconductor substrate and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2016·Granted Aug 14, 2018·0 cites·20 claims
- 4042US10643863B2Semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2017·Granted May 5, 2020·0 cites·23 claims
- 4141US8866311B2Semiconductor package substrates having pillars and related methodsADVANCED SEMICONDUCTOR ENG·Filed 2012·Granted Oct 21, 2014·0 cites·19 claims
- 4241US2008185698A1Semiconductor package structure and carrier structureADVANCED SEMICONDUCTOR ENG·Filed 2007·Application pending·0 cites
- 4340US8592962B2Semiconductor device packages with protective layer and related methodsCHEN KUANG-HSIUNG·Filed 2011·Granted Nov 26, 2013·0 cites·17 claims
- 4440US2008230882A1Chip package structureHSIEH MEI-LIN·Filed 2008·Application pending·0 cites
- 4537US10879159B2Substrate, semiconductor package thereof and process of making sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 29, 2020·0 cites·18 claims
- 4637US10002843B2Semiconductor substrate structure, semiconductor package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jun 19, 2018·0 cites·20 claims
- 4733US2011049704A1Semiconductor device packages with integrated heatsinksADVANCED SEMICONDUCTOR ENG·Filed 2010·Application pending·0 cites
- 4832US2004233637A1Slim type packaging structure with high heat dissipationFiled 2003·Application pending·0 cites
- 4929US8304865B2Leadframe and chip packageHSU YUEH-CHEN·Filed 2010·Granted Nov 6, 2012·0 cites·22 claims
- 5029US8273445B2Reinforced assembly carrierJENG REN YIH·Filed 2008·Granted Sep 25, 2012·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →