Inventor · disambiguated record
Hisataka Ito
Also filed as: ITO HISATAKA
29 granted patents·26 pending applications·463 citations·filing 1995–2015
95Inventor score
Top patents by PatentIndex Score
55 records- 0194US5990546AChip scale package type of semiconductor deviceNITTO DENKO CORP·Filed 1995·Granted Nov 23, 1999·187 cites·19 claims
- 0293US5814894ASemiconductor device, production method thereof, and tape carrier for semiconductor device used for producing the semiconductor deviceNITTO DENKO CORP·Filed 1996·Granted Sep 29, 1998·205 cites·28 claims
- 0386US8723167B2Reflecting material and light emitting diode deviceSATO SATOSHI·Filed 2012·Granted May 13, 2014·9 cites·9 claims
- 0483US9080103B2Phosphor layer attaching kit, optical semiconductor element-phosphor layer attaching body, and optical semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Jul 14, 2015·5 cites·6 claims
- 0582US8796712B2Phosphor layer and light-emitting deviceOOYABU YASUNARI·Filed 2011·Granted Aug 5, 2014·4 cites·4 claims
- 0679US9412920B2Phosphor reflecting sheet, light emitting diode device, and producing method thereofOOYABU YASUNARI·Filed 2012·Granted Aug 9, 2016·5 cites·6 claims
- 0776US9214611B2Reflecting resin sheet, light emitting diode device and producing method thereofOOYABU YASUNARI·Filed 2012·Granted Dec 15, 2015·3 cites·4 claims
- 0871US8916893B2Light-emitting deviceOOYABU YASUNARI·Filed 2011·Granted Dec 23, 2014·3 cites·6 claims
- 0970US7307286B2Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the sameNITTO DENKO CORP·Filed 2004·Granted Dec 11, 2007·17 cites·9 claims
- 1068US8664678B2Phosphor ceramic and light-emitting deviceOOYABU YASUNARI·Filed 2011·Granted Mar 4, 2014·2 cites·4 claims
- 1165US8809900B2Light emitting diode device and producing method thereofSATO SATOSHI·Filed 2012·Granted Aug 19, 2014·2 cites·2 claims
- 1265US8304470B2Resin composition for optical components, optical component using the same and production method of optical lensNORO HIROSHI·Filed 2009·Granted Nov 6, 2012·2 cites·8 claims
- 1364US8680557B2Producing method of light emitting diode device and light emitting diode elementSHINBORI YUKI·Filed 2012·Granted Mar 25, 2014·3 cites·2 claims
- 1463US9608178B2Semiconductor light emitting deviceITO HISATAKA·Filed 2011·Granted Mar 28, 2017·2 cites·6 claims
- 1563US8017670B2Epoxy resin composition for optical-semiconductor encapsulation, cured resin thereof, and optical semiconductor device obtained with the sameNITTO DENKO CORP·Filed 2007·Granted Sep 13, 2011·3 cites·5 claims
- 1657US7986050B2Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using the sameNITTO DENKO CORP·Filed 2009·Granted Jul 26, 2011·1 cites·9 claims
- 1753US8716733B2Transfer sheet for phosphor layer and light-emitting deviceOOYABU YASUNARI·Filed 2011·Granted May 6, 2014·0 cites·5 claims
- 1853US7265167B2Epoxy resin composition for semiconductor encapsulation, and semiconductor device using the sameNITTO DENKO CORP·Filed 2003·Granted Sep 4, 2007·2 cites·7 claims
- 1953US2012160412A1Sealing member, sealing method, and method for producing optical semiconductor deviceOOYABU YASUNARI·Filed 2011·Application pending·0 cites
- 2053US2014367725A1Composite film and semiconductor light emitting device using the sameNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2152US9450160B2Reflecting resin sheet, light emitting diode device and producing method thereofNITTO DENKO CORP·Filed 2015·Granted Sep 20, 2016·0 cites·5 claims
- 2251US2014199795A1Sealing member, sealing method, and method for producing optical semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2349US6852263B2Semiconductor device and process for producing the same, and tablet comprising epoxy resin compositionNITTO DENKO CORP·Filed 2003·Granted Feb 8, 2005·4 cites·6 claims
- 2449US2009311630A1Process for producing optical componentNITTO DENKO CORP·Filed 2009·Application pending·0 cites
- 2549US2016284951A1Method for producing optical semiconductor deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 2649US2016056355A1Reflecting resin sheet, light emitting diode device and producing method thereofNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 2748US7674865B2Photosemiconductor encapsulant of epoxy resin, anhydride and aromatic silicone resinNITTO DENKO CORP·Filed 2006·Granted Mar 9, 2010·0 cites·4 claims
- 2848US2014178678A1Encapsulating sheetNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 2948US2014091346A1Phosphor adhesive sheet, optical semiconductor element-phosphor layer pressure-sensitive adhesive body, and optical semiconductor deviceNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3047US2013329397A1Light source apparatus and lighting apparatusNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3146US9117984B2Encapsulating layer-covered optical semiconductor element, producing method thereof, and optical semiconductor deviceNITTO DENKO CORP·Filed 2013·Granted Aug 25, 2015·0 cites·5 claims
- 3246US7345102B2Epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the sameNITTO DENKO CORP·Filed 2004·Granted Mar 18, 2008·1 cites·6 claims
- 3346US6646063B2Semiconductor device and process for producing the same, and tablet comprising epoxy resin compositionNITTO DENKO CORP·Filed 2001·Granted Nov 11, 2003·3 cites·10 claims
- 3446US2013329416A1Lighting apparatusNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 3545US2009272995A1Resin composition for optical semiconductor element encapsulation, and optical semiconductor device produced by using the sameNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 3644US2011309398A1Composite film and semiconductor light emitting device using the sameITO HISATAKA·Filed 2011·Application pending·0 cites
- 3743US8890190B2Light-emitting diode element in which an optical semiconductor element is encapsulated by an encapsulating resin layer containing a light reflection componentITO HISATAKA·Filed 2012·Granted Nov 18, 2014·0 cites·4 claims
- 3843US2016087170A1Method and system for producing optical semiconductor device, production condition determination device and production management deviceNITTO DENKO CORP·Filed 2014·Application pending·0 cites
- 3942US8642362B2Method for producing light-emitting diode deviceITO HISATAKA·Filed 2012·Granted Feb 4, 2014·0 cites·2 claims
- 4042US2006204761A1Cured product of epoxy resin composition and method for producing the same, and photosemiconductor device using the sameNITTO DENKO CORP·Filed 2006·Application pending·0 cites
- 4141US2012262054A1Reflecting resin sheet, light emitting diode device and producing method thereofOOYABU YASUNARI·Filed 2012·Application pending·0 cites
- 4240US2005261397A1Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the sameNITTO DENKO CORP·Filed 2005·Application pending·0 cites
- 4339US8319228B2Resin composition for optical semiconductor device, optical-semiconductor-device lead frame obtained using the same, and optical semiconductor deviceTANIGUCHI TAKASHI·Filed 2010·Granted Nov 27, 2012·0 cites·6 claims
- 4439US2012028375A1Inspection method of light-emitting device and processing method after inspection of light-emitting deviceSATO SATOSHI·Filed 2011·Application pending·0 cites
- 4539US2012014088A1Component for light-emitting device, light-emitting device and producing method thereofOOYABU YASUNARI·Filed 2011·Application pending·0 cites
- 4639US2012025247A1Component for light-emitting device, light-emitting device and producing method thereofOOYABU YASUNARI·Filed 2011·Application pending·0 cites
- 4739US2012012875A1Component for light-emitting device, light-emitting device and producing method thereofOOYABU YASUNARI·Filed 2011·Application pending·0 cites
- 4839US2012039064A1Light-emitting deviceOOYABU YASUNARI·Filed 2011·Application pending·0 cites
- 4938US6933618B2Tablet comprising epoxy resin compositionNITTO DENKO CORP·Filed 2004·Granted Aug 23, 2005·0 cites·2 claims
- 5037US2012083056A1Light emitting diode sealing member and method for producing light emitting diode deviceSHINBORI YUKI·Filed 2011·Application pending·0 cites
Showing the top 50 of 55 patent records by PatentIndex Score.
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