Inventor · disambiguated record
Eiji Kawamoto
Also filed as: KAWAMOTO EIJI
22 granted patents·3 pending applications·270 citations·filing 1984–2020
95Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD9PANASONIC CORP5TERUMO CORP3YAMAJI TORU3HONJO KAZUHIKO2
Top patents by PatentIndex Score
25 records- 0196US6998532B2Electronic component-built-in moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Feb 14, 2006·124 cites·23 claims
- 0285US8334737B2Acoustic wave device and electronic apparatus using the sameYAMAJI TORU·Filed 2010·Granted Dec 18, 2012·9 cites·12 claims
- 0381US8564171B2Acoustic wave element and electronic device including the sameYAMAJI TORU·Filed 2011·Granted Oct 22, 2013·6 cites·15 claims
- 0478US6347584B1Method of manufacturing electronic components using intaglio plate having dual releasing layersMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 19, 2002·21 cites·9 claims
- 0574US8704424B2Elastic wave device and electronic device using the samePANASONIC CORP·Filed 2013·Granted Apr 22, 2014·3 cites·8 claims
- 0671US8471433B2Elastic wave device and electronic device using the sameYAMAJI TORU·Filed 2010·Granted Jun 25, 2013·3 cites·10 claims
- 0771US7968800B2Passive component incorporating interposerPANASONIC CORP·Filed 2007·Granted Jun 28, 2011·5 cites·6 claims
- 0871US7382628B2Circuit-component-containing moduleMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 3, 2008·15 cites·12 claims
- 0970US7694415B2Method of manufacturing component-embedded printed wiring boardPANASONIC CORP·Filed 2006·Granted Apr 13, 2010·4 cites·24 claims
- 1070US6374733B1Method of manufacturing ceramic substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Apr 23, 2002·32 cites·14 claims
- 1168US6523258B2Method of manufacturing printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 25, 2003·13 cites·20 claims
- 1257US7532485B2Multilayer module and method of manufacturing the samePANASONIC CORP·Filed 2006·Granted May 12, 2009·1 cites·21 claims
- 1356US6890449B2Method for manufacturing printed-circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted May 10, 2005·6 cites·12 claims
- 1452US5448055ADirect-contact type image sensor using optical fiber array with light absorbing claddingMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1993·Granted Sep 5, 1995·13 cites·52 claims
- 1549US7754321B2Method of manufacturing clad board for forming circuitry, clad board and core board for clad boardPANASONIC CORP·Filed 2003·Granted Jul 13, 2010·2 cites·18 claims
- 1648US8382352B2Projector-type headlight and configuration structure of resin projector lens thereofSTANLEY ELECTRIC CO LTD·Filed 2011·Granted Feb 26, 2013·0 cites·7 claims
- 1748US6833042B2Method of manufacturing clad board for forming circuitry, clad board, and core board for clad boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Dec 21, 2004·2 cites·12 claims
- 1846US11813440B2Intradermal needle, packaged article, and injection deviceTERUMO CORP·Filed 2020·Granted Nov 14, 2023·0 cites·20 claims
- 1944US9962491B2Syringe with hanging tagTERUMO CORP·Filed 2012·Granted May 8, 2018·0 cites·7 claims
- 2044US2010147569A1Component-embedded printed wiring boardHONJO KAZUHIKO·Filed 2010·Application pending·0 cites
- 2144US2010146779A1Method of manufacturing component-embedded printed wiring boardHONJO KAZUHIKO·Filed 2010·Application pending·0 cites
- 2243US12362583B2Charging control method, program, and charging control systemPANASONIC IP MAN CO LTD·Filed 2020·Granted Jul 15, 2025·0 cites·12 claims
- 2342US2018015231A1Injection needle assembly, and drug injection deviceTERUMO CORP·Filed 2017·Application pending·0 cites
- 2441US6514364B2Manufacturing method of wiring board, and conductive paste used thereinMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 4, 2003·9 cites·15 claims
- 2539US4595178ALeg for vacuum tank for refining molten steelTOKYO YOGYO KK·Filed 1984·Granted Jun 17, 1986·2 cites·3 claims
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