Inventor · disambiguated record
Chuan-Jin Shiu
Also filed as: SHIU CHUAN-JIN
14 granted patents·36 citations·filing 2010–2016
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
14 records- 0188US8890191B2Chip package and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Nov 18, 2014·13 cites·16 claims
- 0287US8575634B2Chip package and method for fabricating the sameLIU TSANG-YU·Filed 2010·Granted Nov 5, 2013·9 cites·21 claims
- 0370US8536671B2Chip packageLIU TSANG-YU·Filed 2011·Granted Sep 17, 2013·3 cites·28 claims
- 0465US8431946B2Chip package and method for forming the sameCHIU HSIN-CHIH·Filed 2011·Granted Apr 30, 2013·2 cites·20 claims
- 0561US8785956B2Chip package having optical-electronic device with plurality of light shielding layers and substrate through-hole with void, and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Jul 22, 2014·2 cites·20 claims
- 0659US8836134B2Semiconductor stacked package and method of fabricating the sameLIN PO-SHEN·Filed 2013·Granted Sep 16, 2014·1 cites·10 claims
- 0759US8633558B2Package structure for a chip and method for fabricating the sameLIN TA-HSUAN·Filed 2010·Granted Jan 21, 2014·2 cites·19 claims
- 0858US8604578B2Chip packageCHIU HSIN-CHIH·Filed 2011·Granted Dec 10, 2013·1 cites·19 claims
- 0957US8384174B2Chip packageCHIU HSIN-CHIH·Filed 2011·Granted Feb 26, 2013·1 cites·20 claims
- 1056US9230927B2Method of fabricating wafer-level chip packageXINTEC INC·Filed 2014·Granted Jan 5, 2016·1 cites·17 claims
- 1154US8779452B2Chip packageHUNG TZU-HSIANG·Filed 2011·Granted Jul 15, 2014·1 cites·21 claims
- 1243US10388541B2Wafer coating system and method of manufacturing chip packageXINTEC INC·Filed 2016·Granted Aug 20, 2019·0 cites·14 claims
- 1341US9613904B2Semiconductor structure and manufacturing method thereofXINTEC INC·Filed 2016·Granted Apr 4, 2017·0 cites·12 claims
- 1432US8900913B2Chip package and method for forming the sameSHIU CHUAN-JIN·Filed 2012·Granted Dec 2, 2014·0 cites·19 claims
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