Inventor · disambiguated record
Zhongfa Yuan
Also filed as: YUAN ZHONGFA
6 granted patents·3 pending applications·40 citations·filing 2007–2011
79Inventor score
Top patents by PatentIndex Score
9 records- 0184US8106406B2Die package including substrate with molded deviceLIU YONG·Filed 2008·Granted Jan 31, 2012·12 cites·7 claims
- 0281US7589338B2Semiconductor die packages suitable for optoelectronic applications having clip attach structures for angled mounting of diceFAIRCHILD SEMICONDUCTOR·Filed 2007·Granted Sep 15, 2009·12 cites·26 claims
- 0378US7768108B2Semiconductor die package including embedded flip chipFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Aug 3, 2010·12 cites·20 claims
- 0469US7745244B2Pin substrate and packageFAIRCHILD SEMICONDUCTOR·Filed 2008·Granted Jun 29, 2010·4 cites·15 claims
- 0548US8525192B2Die package including substrate with molded deviceLIU YONG·Filed 2011·Granted Sep 3, 2013·0 cites·19 claims
- 0644US8120169B2Thermally enhanced molded leadless packageLIU YONG·Filed 2008·Granted Feb 21, 2012·0 cites·27 claims
- 0743US2009212405A1Stacked die molded leadless packageLIU YONG·Filed 2008·Application pending·0 cites
- 0841US2009140266A1Package including oriented devicesLIU YONG·Filed 2007·Application pending·0 cites
- 0938US2009256245A1Stacked Micro-Module Packages, Systems Using the Same, and Methods of Making the SameLIU YONG·Filed 2008·Application pending·0 cites
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