Inventor · disambiguated record
Li-Chiang Chen
Also filed as: CHEN LI-CHIANG
17 granted patents·94 citations·filing 1992–2018
91Inventor score
Top patents by PatentIndex Score
17 records- 0191US10062613B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·6 cites·10 claims
- 0285US10249629B1Method for forming buried word linesUNITED MICROELECTRONICS CORP·Filed 2018·Granted Apr 2, 2019·4 cites·14 claims
- 0382US9023708B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·6 cites·18 claims
- 0474US10032631B1Method of fabricating mask patternUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jul 24, 2018·2 cites·9 claims
- 0568US5286458AInjection type non-catalyst denitrogen oxide process control systemIND TECH RES INST·Filed 1992·Granted Feb 15, 1994·37 cites·7 claims
- 0664US9165997B2Semiconductor processUNITED MICROELECTRONICS CORP·Filed 2014·Granted Oct 20, 2015·1 cites·10 claims
- 0759US5186607ASwirl generator with axial vanesIND TECH RES INST·Filed 1992·Granted Feb 16, 1993·18 cites·5 claims
- 0858US5433600ABurner for the combustion of coke oven gasIND TECH RES INST·Filed 1994·Granted Jul 18, 1995·20 cites·4 claims
- 0957US10937701B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Mar 2, 2021·0 cites·7 claims
- 1048US8952392B2Semiconductor structure and process thereofCHEN CHIEH-TE·Filed 2012·Granted Feb 10, 2015·0 cites·11 claims
- 1146US10475649B2Patterning methodUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·0 cites·13 claims
- 1246US10141223B2Method of improving micro-loading effect when recess etching tungsten layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 27, 2018·0 cites·7 claims
- 1345US10192777B2Method of fabricating STI trenchUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 29, 2019·0 cites·7 claims
- 1445US9887088B1Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 6, 2018·0 cites·14 claims
- 1542US9553026B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jan 24, 2017·0 cites·5 claims
- 1637US10199258B2Method of fabricating isolation structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 5, 2019·0 cites·1 claims
- 1736US8691659B2Method for forming void-free dielectric layerHSU CHING-PIN·Filed 2011·Granted Apr 8, 2014·0 cites·20 claims
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