Inventor · disambiguated record
Shang-Yuan Tsai
Also filed as: TSAI SHANG-YUAN
9 granted patents·3 pending applications·24 citations·filing 2010–2015
82Inventor score
Top patents by PatentIndex Score
12 records- 0185US8574990B2Method of manufacturing semiconductor device having metal gateLIAO PO-JUI·Filed 2011·Granted Nov 5, 2013·9 cites·20 claims
- 0282US9023708B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2013·Granted May 5, 2015·6 cites·18 claims
- 0378US8592321B2Method for fabricating an apertureCHANG FENG-YI·Filed 2011·Granted Nov 26, 2013·4 cites·14 claims
- 0467US9196524B2Manufacturing method of semiconductor deviceCHEN CHIEH-TE·Filed 2012·Granted Nov 24, 2015·2 cites·10 claims
- 0561US9337084B1Method for manufacturing contact holes of a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 10, 2016·1 cites·14 claims
- 0657US8252650B1Method for fabricating CMOS transistorCHANG FENG-YI·Filed 2011·Granted Aug 28, 2012·1 cites·15 claims
- 0755US8835324B2Method for forming contact holesCHEN CHIEH-TE·Filed 2011·Granted Sep 16, 2014·1 cites·13 claims
- 0850US2014038399A1Method for fabricating an apertureUNITED MICROELECTRONICS CORP·Filed 2013·Application pending·0 cites
- 0940US9799550B2Manufacturing method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2015·Granted Oct 24, 2017·0 cites·18 claims
- 1036US8691659B2Method for forming void-free dielectric layerHSU CHING-PIN·Filed 2011·Granted Apr 8, 2014·0 cites·20 claims
- 1136US2011223768A1Method for Forming Contact OpeningUNITED MICROELECTRONICS CORP·Filed 2010·Application pending·0 cites
- 1235US2011174774A1Method of descumming patterned photoresistLIN YING-CHIH·Filed 2010·Application pending·0 cites
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