Inventor · disambiguated record
Yongguo Chen
Also filed as: CHEN YONGGUO
8 granted patents·4 pending applications·12 citations·filing 2013–2023
79Inventor score
Files withCISCO TECH INC12
Top patents by PatentIndex Score
12 records- 0193US11465248B1System and method for removing components of a fluid cooling system during operationCISCO TECH INC·Filed 2021·Granted Oct 11, 2022·6 cites·20 claims
- 0290US12207435B2Cooling fan assembly with air guiderCISCO TECH INC·Filed 2022·Granted Jan 21, 2025·2 cites·20 claims
- 0385US11778725B2Thermal interface material (TIM) filling structure for high warpage chipsCISCO TECH INC·Filed 2021·Granted Oct 3, 2023·1 cites·20 claims
- 0483US12209596B2Configurable bi-directional airflow fanCISCO TECH INC·Filed 2023·Granted Jan 28, 2025·2 cites·18 claims
- 0573US12156324B2Thermal Interface Material (TIM) filling structure for high warpage chipsCISCO TECH INC·Filed 2023·Granted Nov 26, 2024·0 cites·19 claims
- 0658US12167567B2Fan silencer moduleCISCO TECH INC·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 0757US2025189181A1Coolant refresh device for coolant distribution unitCISCO TECH INC·Filed 2023·Application pending·0 cites
- 0855US11758689B2Vapor chamber embedded remote heatsinkCISCO TECH INC·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0955US9431317B2Power doubler amplifier module with improved solder coverage between a heat sink and a thermal pad of a circuit packageCISCO TECH INC·Filed 2013·Granted Aug 30, 2016·1 cites·15 claims
- 1055US2023392873A1Remote directional vapor chamber heat sinkCISCO TECH INC·Filed 2022·Application pending·0 cites
- 1154US2024105549A1Heatsink for ring type integrated circuitsCISCO TECH INC·Filed 2023·Application pending·0 cites
- 1250US2023247799A1Heat pipe with localized heatsinkCISCO TECH INC·Filed 2022·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →