Inventor · disambiguated record
Kiyoaki Kodama
Also filed as: KODAMA KIYOAKI
3 granted patents·13 pending applications·10 citations·filing 2010–2020
62Inventor score
Top patents by PatentIndex Score
16 records- 0181US9150716B2Resin foam and foam sealing materialSAITOU MAKOTO·Filed 2011·Granted Oct 6, 2015·4 cites·9 claims
- 0278US9156959B2Polyester elastomer foam and foam materialKATO KAZUMICHI·Filed 2012·Granted Oct 13, 2015·4 cites·10 claims
- 0368US9522985B2Polyester elastomer foamKODAMA KIYOAKI·Filed 2012·Granted Dec 20, 2016·2 cites·12 claims
- 0467US2022185979A1Resin foam body and foam memberNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0566US2022185982A1Flame-retardant foamed object and foam memberNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 0654US2015118481A1Resin foam and foam materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0749US2015218422A1Resin foam and foam materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0849US2015140315A1Resin foam and foam materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 0948US2020109245A1Temporary fixing sheetNITTO DENKO CORP·Filed 2018·Application pending·0 cites
- 1047US2022204813A1Adhesive skin patch materialNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1147US2013017391A1Resin foam and foam sealing materialNITTO DENKO CORP·Filed 2012·Application pending·0 cites
- 1246US2015099112A1Resin foam and foam sealing materialNITTO DENKO CORP·Filed 2013·Application pending·0 cites
- 1345US2011262744A1Resin foam and foamed memberNITTO DENKO CORP·Filed 2011·Application pending·0 cites
- 1443US2016121576A1Electroconductive pressure-sensitive adhesive cushioningNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1543US2022151836A1Adhesive skin patch materialNITTO DENKO CORP·Filed 2020·Application pending·0 cites
- 1630US2012183760A1Low dielectric sheet for 2-d communication, production method therefor, and sheet structure for communicationKODAMA KIYOAKI·Filed 2010·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →