Inventor · disambiguated record
Ronald J. Nagahara
Also filed as: NAGAHARA RONALD J
20 granted patents·593 citations·filing 1997–2003
96Inventor score
Files withLSI LOGIC CORP20
Top patents by PatentIndex Score
20 records- 0194US5931719AMethod and apparatus for using pressure differentials through a polishing pad to improve performance in chemical mechanical polishingLSI LOGIC CORP·Filed 1997·Granted Aug 3, 1999·131 cites·17 claims
- 0290US6168508B1Polishing pad surface for improved process controlLSI LOGIC CORP·Filed 1997·Granted Jan 2, 2001·92 cites·25 claims
- 0386US6417093B1Process for planarization of metal-filled trenches of integrated circuit structures by forming a layer of planarizable material over the metal layer prior to planarizingLSI LOGIC CORP·Filed 2000·Granted Jul 9, 2002·52 cites·23 claims
- 0485US6179956B1Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishingLSI LOGIC CORP·Filed 1999·Granted Jan 30, 2001·57 cites·4 claims
- 0576US6752916B1Electrochemical planarization end point detectionLSI LOGIC CORP·Filed 2002·Granted Jun 22, 2004·10 cites·14 claims
- 0675US6607967B1Process for forming planarized isolation trench in integrated circuit structure on semiconductor substrateLSI LOGIC CORP·Filed 2000·Granted Aug 19, 2003·19 cites·16 claims
- 0774US5941761AShaping polishing pad to control material removal rate selectivelyLSI LOGIC CORP·Filed 1997·Granted Aug 24, 1999·37 cites·32 claims
- 0872US6503828B1Process for selective polishing of metal-filled trenches of integrated circuit structuresLSI LOGIC CORP·Filed 2001·Granted Jan 7, 2003·21 cites·31 claims
- 0965US6066266AIn-situ chemical-mechanical polishing slurry formulation for compensation of polish pad degradationLSI LOGIC CORP·Filed 1998·Granted May 23, 2000·32 cites·31 claims
- 1065US5961375AShimming substrate holder assemblies to produce more uniformly polished substrate surfacesLSI LOGIC CORP·Filed 1997·Granted Oct 5, 1999·30 cites·23 claims
- 1164US6074288AModified carrier films to produce more uniformly polished substrate surfacesLSI LOGIC CORP·Filed 1997·Granted Jun 13, 2000·24 cites·28 claims
- 1262US6489242B1Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structuresLSI LOGIC CORP·Filed 2000·Granted Dec 3, 2002·7 cites·2 claims
- 1359US6531397B1Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishingLSI LOGIC CORP·Filed 1998·Granted Mar 11, 2003·17 cites·5 claims
- 1457US6106371AEffective pad conditioningLSI LOGIC CORP·Filed 1997·Granted Aug 22, 2000·18 cites·32 claims
- 1556US5944585AUse of abrasive tape conveying assemblies for conditioning polishing padsLSI LOGIC CORP·Filed 1997·Granted Aug 31, 1999·18 cites·24 claims
- 1653US6372524B1Method for CMP endpoint detectionLSI LOGIC CORP·Filed 2001·Granted Apr 16, 2002·4 cites·20 claims
- 1751US6114215AGenerating non-planar topology on the surface of planar and near-planar substratesLSI LOGIC CORP·Filed 1998·Granted Sep 5, 2000·19 cites·19 claims
- 1849US6586326B2Metal planarization systemLSI LOGIC CORP·Filed 2001·Granted Jul 1, 2003·3 cites·6 claims
- 1947US6713394B2Process for planarization of integrated circuit structure which inhibits cracking of low dielectric constant dielectric material adjacent underlying raised structuresLSI LOGIC CORP·Filed 2002·Granted Mar 30, 2004·1 cites·17 claims
- 2045US6951808B2Metal planarization systemLSI LOGIC CORP·Filed 2003·Granted Oct 4, 2005·1 cites·11 claims
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