Inventor · disambiguated record
Islam A. Salama
Also filed as: SALAMA ISLAM · SALAMA ISLAM A
66 granted patents·27 pending applications·368 citations·filing 2004–2025
98Inventor score
Top patents by PatentIndex Score
93 records- 0199US10163798B1Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling sameINTEL CORP·Filed 2017·Granted Dec 25, 2018·105 cites·25 claims
- 0296US11043457B2Embedded multi-die interconnect bridge packages with lithotgraphically formed bumps and methods of assembling sameINTEL CORP·Filed 2020·Granted Jun 22, 2021·3 cites·9 claims
- 0396US7951632B1Optical device and method of makingUNIV CENTRAL FLORIDA·Filed 2006·Granted May 31, 2011·29 cites·11 claims
- 0496US7268063B1Process for fabricating semiconductor componentUNIV CENTRAL FLORIDA·Filed 2005·Granted Sep 11, 2007·32 cites·15 claims
- 0594US12014989B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Jun 18, 2024·1 cites·20 claims
- 0694US10707168B2Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling sameINTEL CORP·Filed 2018·Granted Jul 7, 2020·7 cites·14 claims
- 0794US9119313B2Package substrate with high density interconnect design to capture conductive features on embedded dieINTEL CORP·Filed 2013·Granted Aug 25, 2015·23 cites·25 claims
- 0893US9505607B2Methods of forming sensor integrated packages and structures formed therebyINTEL CORP·Filed 2015·Granted Nov 29, 2016·8 cites·22 claims
- 0991US10306760B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodINTEL CORP·Filed 2017·Granted May 28, 2019·6 cites·6 claims
- 1091US8372666B2Misalignment correction for embedded microelectronic die applicationsINTEL CORP·Filed 2010·Granted Feb 12, 2013·20 cites·12 claims
- 1190US8440916B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodLI YONGGANG·Filed 2007·Granted May 14, 2013·17 cites·23 claims
- 1289US2025323167A1Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2025·Application pending·0 cites
- 1387US8928151B2Hybrid core through holes and viasINTEL CORP·Filed 2013·Granted Jan 6, 2015·7 cites·14 claims
- 1486US9202803B2Laser cavity formation for embedded dies or components in substrate build-up layersZHANG CHONG·Filed 2014·Granted Dec 1, 2015·8 cites·14 claims
- 1586US8912549B2Optical device and method of makingQUICK NATHANIEL R·Filed 2011·Granted Dec 16, 2014·5 cites·10 claims
- 1686US8552564B2Hybrid-core through holes and viasROY MIHIR K·Filed 2010·Granted Oct 8, 2013·7 cites·23 claims
- 1786US2024332203A1Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2024·Application pending·0 cites
- 1884US11430740B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2017·Granted Aug 30, 2022·2 cites·13 claims
- 1984US2024258240A1Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2024·Application pending·0 cites
- 2083US8278214B2Through mold via polymer block packageROY MIHIR K·Filed 2009·Granted Oct 2, 2012·10 cites·8 claims
- 2181US9865568B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2015·Granted Jan 9, 2018·3 cites·20 claims
- 2281US9361059B2Architecture for seamless integrated display systemINTEL CORP·Filed 2012·Granted Jun 7, 2016·5 cites·18 claims
- 2380US11894311B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2022·Granted Feb 6, 2024·0 cites·19 claims
- 2480US7237334B2Method of providing a printed circuit board using laser assisted metallization and patterning of a microelectronic substrateINTEL CORP·Filed 2005·Granted Jul 3, 2007·7 cites·15 claims
- 2579US9648733B2Method of forming a substrate core structure using microvia laser drilling and conductive layer pre-patterning and substrate core structure formed according to the methodLI YONGGANG·Filed 2013·Granted May 9, 2017·3 cites·4 claims
- 2679US8080836B2Embedded semiconductor componentQUICK NATHANIEL R·Filed 2007·Granted Dec 20, 2011·5 cites·23 claims
- 2778US12046560B2Microelectronic device with embedded die substrate on interposerINTEL CORP·Filed 2021·Granted Jul 23, 2024·0 cites·19 claims
- 2878US12040276B2Device and method of very high density routing used with embedded multi-die interconnect bridgeINTEL CORP·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 2978US7998857B2Integrated circuit and process for fabricating thereofINTEL CORP·Filed 2007·Granted Aug 16, 2011·6 cites·10 claims
- 3077US11581271B2Methods to pattern TFC and incorporation in the ODI architecture and in any build up layer of organic substrateINTEL CORP·Filed 2019·Granted Feb 14, 2023·2 cites·27 claims
- 3177US10424561B2Integrated circuit structures with recessed conductive contacts for package on packageINTEL CORP·Filed 2018·Granted Sep 24, 2019·2 cites·25 claims
- 3277US7583871B1Substrates for optical die structuresBCHIR OMAR J·Filed 2008·Granted Sep 1, 2009·8 cites·23 claims
- 3374US9211609B2Laser via drilling apparatus and methodsSALAMA ISLAM A·Filed 2005·Granted Dec 15, 2015·5 cites·11 claims
- 3474US9064798B2Optical device and method of makingQUICK NATHANIEL R·Filed 2011·Granted Jun 23, 2015·2 cites·6 claims
- 3573US11764158B2Embedded multi-die interconnect bridge packages with lithographically formed bumps and methods of assembling sameINTEL CORP·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 3671US7831115B2Optical die structures and associated package substratesINTEL CORP·Filed 2008·Granted Nov 9, 2010·2 cites·23 claims
- 3770US9397071B2High density interconnection of microelectronic devicesINTEL CORP·Filed 2013·Granted Jul 19, 2016·2 cites·12 claims
- 3870US8094459B2Microelectronic substrate including embedded components and spacer layer and method of forming sameSALAMA ISLAM·Filed 2010·Granted Jan 10, 2012·3 cites·10 claims
- 3969US7808797B2Microelectronic substrate including embedded components and spacer layer and method of forming sameINTEL CORP·Filed 2006·Granted Oct 5, 2010·4 cites·16 claims
- 4068US11552019B2Substrate patch reconstitution optionsINTEL CORP·Filed 2019·Granted Jan 10, 2023·1 cites·26 claims
- 4166US8003479B2Low temperature deposition and ultra fast annealing of integrated circuit thin film capacitorINTEL CORP·Filed 2006·Granted Aug 23, 2011·2 cites·21 claims
- 4266US7985622B2Method of forming collapse chip connection bumps on a semiconductor substrateINTEL CORP·Filed 2008·Granted Jul 26, 2011·3 cites·16 claims
- 4366US7923059B2Method of enabling selective area plating on a substrateINTEL CORP·Filed 2007·Granted Apr 12, 2011·2 cites·8 claims
- 4466US7891091B2Method of enabling selective area plating on a substrateLI YONGGANG·Filed 2008·Granted Feb 22, 2011·3 cites·20 claims
- 4564US7738257B2Microelectronic device including bridging interconnect to top conductive layer of passive embedded structure and method of making sameINTEL CORP·Filed 2006·Granted Jun 15, 2010·2 cites·12 claims
- 4663US9442286B2Spaced configuration of acousto-optic deflectors for laser beam scanning of a semiconductor substrateLI YONGGANG·Filed 2011·Granted Sep 13, 2016·1 cites·27 claims
- 4762US8288682B2Forming micro-vias using a two stage laser drilling processSALAMA ISLAM·Filed 2007·Granted Oct 16, 2012·2 cites·18 claims
- 4862US8017022B2Selective electroless plating for electronic substratesINTEL CORP·Filed 2007·Granted Sep 13, 2011·1 cites·9 claims
- 4959US10043740B2Package with passivated interconnectsBOYAPATI SRI RANGA SAI·Filed 2016·Granted Aug 7, 2018·1 cites·20 claims
- 5059US7765691B2Method and apparatus for a printed circuit board using laser assisted metallization and patterning of a substrateINTEL CORP·Filed 2005·Granted Aug 3, 2010·1 cites·9 claims
Showing the top 50 of 93 patent records by PatentIndex Score.
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