Inventor · disambiguated record
Stefano S. Oggioni
Also filed as: OGGIONI STEFANO · OGGIONI STEFANO S · OGGIONI STEFANO SERGIO
104 granted patents·10 pending applications·757 citations·filing 1996–2024
99Inventor score
Top patents by PatentIndex Score
114 records- 0198US7331796B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2006·Granted Feb 19, 2008·50 cites·7 claims
- 0297US7832095B2Method of forming a land grid array (LGA) interposer arrangement utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·24 cites·3 claims
- 0396US7665999B2Land grid array (LGA) interposer structure of a moldable dielectric polymer providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2008·Granted Feb 23, 2010·19 cites·3 claims
- 0496US7354277B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 8, 2008·20 cites·4 claims
- 0595US10168185B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2015·Granted Jan 1, 2019·10 cites·8 claims
- 0695US7836585B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 23, 2010·16 cites·3 claims
- 0795US7832094B2Method of operatively combining a plurality of components to form a land grip array interposer (LGA) structure utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2008·Granted Nov 16, 2010·16 cites·5 claims
- 0895US7823283B2Method of forming a land grid array interposerIBM·Filed 2008·Granted Nov 2, 2010·16 cites·8 claims
- 0995US7484966B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 3, 2009·16 cites·1 claims
- 1095US7361025B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·16 cites·6 claims
- 1194US7382946B2Electro-optical module comprising flexible connection cable and method of making the sameIBM·Filed 2007·Granted Jun 3, 2008·29 cites·7 claims
- 1293US8037600B2Method of producing a land grid array interposer structureIBM·Filed 2008·Granted Oct 18, 2011·11 cites·7 claims
- 1393US7703201B2Method of embedding tamper proof layers and discrete components into printed circuit board stack-upIBM·Filed 2005·Granted Apr 27, 2010·27 cites·13 claims
- 1492US7505284B2System for assembling electronic components of an electronic systemIBM·Filed 2006·Granted Mar 17, 2009·24 cites·14 claims
- 1591US10321589B2Tamper-respondent assembly with sensor connection adapterIBM·Filed 2016·Granted Jun 11, 2019·7 cites·20 claims
- 1691US10299372B2Vented tamper-respondent assembliesIBM·Filed 2016·Granted May 21, 2019·6 cites·17 claims
- 1791US9673179B1Discrete electronic device embedded in chip moduleIBM·Filed 2016·Granted Jun 6, 2017·6 cites·20 claims
- 1891US7788801B2Method for manufacturing a tamper-proof cap for an electronic moduleIBM·Filed 2006·Granted Sep 7, 2010·23 cites·5 claims
- 1988US10378925B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2018·Granted Aug 13, 2019·3 cites·9 claims
- 2088US10175064B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2015·Granted Jan 8, 2019·4 cites·7 claims
- 2188US8938627B2Multilayer securing structure and method thereof for the protection of cryptographic keys and codeOGGIONI STEFANO S·Filed 2010·Granted Jan 20, 2015·13 cites·13 claims
- 2288US8444328B2Electro-optical assembly fabricationOGGIONI STEFANO SERGIO·Filed 2010·Granted May 21, 2013·10 cites·2 claims
- 2388US7360308B2Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriersIBM·Filed 2006·Granted Apr 22, 2008·19 cites·4 claims
- 2488US5825628AElectronic package with enhanced pad designIBM·Filed 1996·Granted Oct 20, 1998·115 cites·10 claims
- 2587US10153250B2Flip-chip electronic device with carrier having heat dissipation elements free of solder maskIBM·Filed 2014·Granted Dec 11, 2018·6 cites·6 claims
- 2686US7658616B2Groups of land grid interposers of different heights having metal-on elastomer hemi-torus shapes providing for electrical contact with at least one component on an opposite side of an electrically insulating carrier plate mounting interposersIBM·Filed 2008·Granted Feb 9, 2010·5 cites·1 claims
- 2786US6710258B2Circuitized substrate for high-frequency applicationsIBM·Filed 2002·Granted Mar 23, 2004·45 cites·11 claims
- 2885US9433077B2Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate sectionIBM·Filed 2015·Granted Aug 30, 2016·5 cites·12 claims
- 2985US7915540B2Tamper-proof structures for protecting electronic modulesIBM·Filed 2007·Granted Mar 29, 2011·12 cites·11 claims
- 3084US10378924B2Circuit boards and electronic packages with embedded tamper-respondent sensorIBM·Filed 2018·Granted Aug 13, 2019·2 cites·16 claims
- 3184US7467951B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Dec 23, 2008·4 cites·4 claims
- 3282US7091424B2Coaxial via structure for optimizing signal transmission in multiple layer electronic device carriersIBM·Filed 2003·Granted Aug 15, 2006·33 cites·5 claims
- 3381US11244079B2Data detection mitigation in printed circuit boardsIBM·Filed 2019·Granted Feb 8, 2022·2 cites·20 claims
- 3481US7374428B2Land Grid Array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted May 20, 2008·3 cites·4 claims
- 3581US7361026B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Apr 22, 2008·3 cites·6 claims
- 3680US10271424B2Tamper-respondent assemblies with in situ vent structure(s)IBM·Filed 2016·Granted Apr 23, 2019·3 cites·20 claims
- 3780US10008081B2Electronic devices with individual security circuitsIBM·Filed 2016·Granted Jun 26, 2018·2 cites·16 claims
- 3880US9698089B2Substrate device and electric circuit arrangement having first substrate section perpendicular to second substrate sectionIBM·Filed 2016·Granted Jul 4, 2017·4 cites·20 claims
- 3977US8870472B2Computer program product for electro-optical assemblyIBM·Filed 2012·Granted Oct 28, 2014·2 cites·2 claims
- 4077US8191245B2Method of forming a land grid array (LGA) interposerHOUGHAM GARETH G·Filed 2008·Granted Jun 5, 2012·2 cites·18 claims
- 4177US7523547B2Method for attaching a flexible structure to a device and a device having a flexible structureIBM·Filed 2006·Granted Apr 28, 2009·3 cites·1 claims
- 4277US7491067B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Feb 17, 2009·2 cites·5 claims
- 4377US7488182B2Land grid array (LGA) interposer structure providing for electrical contacts on opposite sides of a carrier planeIBM·Filed 2007·Granted Feb 10, 2009·2 cites·4 claims
- 4477US7402052B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Jul 22, 2008·2 cites·5 claims
- 4577US7381063B2Land grid array (LGA) interposer utilizing metal-on-elastomer hemi-torus and other multiple points of contact geometriesIBM·Filed 2007·Granted Jun 3, 2008·2 cites·4 claims
- 4677US6617698B2Reworkable and thermally conductive adhesive and use thereofIBM·Filed 2001·Granted Sep 9, 2003·11 cites·8 claims
- 4775US8286345B2Method for attaching a flexible structure to a deviceDANGEL ROGER·Filed 2009·Granted Oct 16, 2012·3 cites·22 claims
- 4875US7319197B2Structure of stacked vias in multiple layer electrode device carriersIBM·Filed 2003·Granted Jan 15, 2008·28 cites·10 claims
- 4974US10496851B1Secure signal integrityIBM·Filed 2019·Granted Dec 3, 2019·1 cites·20 claims
- 5074US10388127B2Electronic devices with individual security circuitsIBM·Filed 2018·Granted Aug 20, 2019·1 cites·20 claims
Showing the top 50 of 114 patent records by PatentIndex Score.
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