Inventor · disambiguated record
Jeffrey T. Coffin
Also filed as: COFFIN JEFFREY T · COFFIN JEFFREY THOMAS
13 granted patents·1 pending application·514 citations·filing 1989–2011
93Inventor score
Top patents by PatentIndex Score
14 records- 0192US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 0292US5990418AHermetic CBGA/CCGA structure with thermal paste coolingIBM·Filed 1997·Granted Nov 23, 1999·156 cites·19 claims
- 0388US6413353B2Method for direct attachment of a chip to a cooling memberIBM·Filed 1999·Granted Jul 2, 2002·68 cites·15 claims
- 0480US7319591B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2005·Granted Jan 15, 2008·7 cites·10 claims
- 0579US5881945AMulti-layer solder seal band for semiconductor substrates and processIBM·Filed 1997·Granted Mar 16, 1999·57 cites·26 claims
- 0678US8492199B2Reworkable underfills for ceramic MCM C4 protectionCOFFIN JEFFREY T·Filed 2011·Granted Jul 23, 2013·6 cites·20 claims
- 0778US5881944AMulti-layer solder seal band for semiconductor substratesIBM·Filed 1997·Granted Mar 16, 1999·53 cites·21 claims
- 0867US5049201AMethod of inhibiting corrosion in an electronic packageIBM·Filed 1989·Granted Sep 17, 1991·32 cites·20 claims
- 0966US8037594B2Method of forming a flip-chip packageIBM·Filed 2008·Granted Oct 18, 2011·2 cites·14 claims
- 1066US7489512B2Optimized thermally conductive plate and attachment method for enhanced thermal performance and reliability of flip chip organic packagesIBM·Filed 2007·Granted Feb 10, 2009·2 cites·13 claims
- 1166US6462271B2Capping structure for electronics package undergoing compressive socket actuationIBM·Filed 2000·Granted Oct 8, 2002·13 cites·32 claims
- 1256US6218629B1Module with metal-ion matrix induced dendrites for interconnectionIBM·Filed 1999·Granted Apr 17, 2001·18 cites·11 claims
- 1349US6584684B2Method for assembling a carrier and a semiconductor deviceIBM·Filed 2001·Granted Jul 1, 2003·3 cites·16 claims
- 1447US2007290378A1Novel reworkable underfills for ceramic mcm c4 protectionIBM·Filed 2006·Application pending·0 cites
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