Inventor · disambiguated record
Toshinobu Miyagoshi
Also filed as: MIYAGOSHI TOSHINOBU
11 granted patents·3 pending applications·25 citations·filing 2003–2023
84Inventor score
Top patents by PatentIndex Score
14 records- 0171US7828190B2Ultrasonic mounting apparatusTDK CORP·Filed 2009·Granted Nov 9, 2010·6 cites·5 claims
- 0269US11167541B2Apparatus for manufacturing element array and apparatus for removing specific elementTDK CORP·Filed 2019·Granted Nov 9, 2021·1 cites·18 claims
- 0368US6931717B2Apparatus for mounting an electronic part onto a circuit substrateTDK CORP·Filed 2003·Granted Aug 23, 2005·12 cites·1 claims
- 0465US7814645B2Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibrationTDK CORP·Filed 2008·Granted Oct 19, 2010·4 cites·7 claims
- 0562US11267071B2Ultrasonic bonding head, ultrasonic bonding device, and ultrasonic bonding methodTDK CORP·Filed 2019·Granted Mar 8, 2022·1 cites·10 claims
- 0658US12406866B2Stamp tool, transfer device, and element array manufacturing methodTDK CORP·Filed 2021·Granted Sep 2, 2025·0 cites·19 claims
- 0755US2023381904A1Substrate processing apparatusTDK CORP·Filed 2023·Application pending·0 cites
- 0854US11101317B2Method of manufacturing element array and method of removing specific elementTDK CORP·Filed 2019·Granted Aug 24, 2021·0 cites·17 claims
- 0953US7508115B2Horn, horn unit, and bonding apparatus using sameTDK CORP·Filed 2006·Granted Mar 24, 2009·1 cites·4 claims
- 1047US2023093241A1Element array pressurizing device, manufacturing device, and manufacturing methodTDK CORP·Filed 2021·Application pending·0 cites
- 1142US11541477B2Ultrasonic bonding device and ultrasonic bonding methodTDK CORP·Filed 2019·Granted Jan 3, 2023·0 cites·6 claims
- 1241US7181833B2Method of mounting an electronic partTDK CORP·Filed 2004·Granted Feb 27, 2007·0 cites·2 claims
- 1340US10162137B2Apparatus and method for mounting photoelectric elementNIPPON MEKTRON KK·Filed 2013·Granted Dec 25, 2018·0 cites·8 claims
- 1436US2005097728A1Contact start detecting apparatus for mounting process apparatus, and mounting process apparatus provided with the sameTDK CORP·Filed 2004·Application pending·0 cites
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