Inventor · disambiguated record
Yoshihisa Takase
Also filed as: TAKASE YOSHIHISA
9 granted patents·313 citations·filing 1991–2003
90Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD9
Top patents by PatentIndex Score
9 records- 0188US6028011AMethod of forming electric pad of semiconductor device and method of forming solder bumpMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1998·Granted Feb 22, 2000·115 cites·16 claims
- 0285US5208450AIC card and a method for the manufacture of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1991·Granted May 4, 1993·98 cites·2 claims
- 0378US7212094B2Inductive components and electronic devices using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted May 1, 2007·17 cites·21 claims
- 0478US7151228B2Laminating double-side circuit board, manufacturing method thereof, and multilayer printed circuit board using sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Dec 19, 2006·25 cites·10 claims
- 0578US6347584B1Method of manufacturing electronic components using intaglio plate having dual releasing layersMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Feb 19, 2002·21 cites·9 claims
- 0661US7197820B2Circuit board and its manufacturing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Apr 3, 2007·9 cites·11 claims
- 0761US6753033B2Method of manufacturing ceramic thick-film printed circuit boardMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Jun 22, 2004·10 cites·10 claims
- 0859US6791818B1Electronic deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Sep 14, 2004·9 cites·7 claims
- 0941US6514364B2Manufacturing method of wiring board, and conductive paste used thereinMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 1999·Granted Feb 4, 2003·9 cites·15 claims
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