Inventor · disambiguated record
Mark K. Hoffmeyer
Also filed as: HOFFMEYER MARK · HOFFMEYER MARK K · HOFFMEYER MARK KENNETH
91 granted patents·7 pending applications·1,282 citations·filing 1991–2023
99Inventor score
Top patents by PatentIndex Score
98 records- 0196US10048312B1Testing printed circuit board assemblyIBM·Filed 2017·Granted Aug 14, 2018·9 cites·1 claims
- 0295US7658617B1Plastic land grid array (PLGA) module with inverted hybrid land grid array (LGA) interposerIBM·Filed 2009·Granted Feb 9, 2010·30 cites·20 claims
- 0395US7486516B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2005·Granted Feb 3, 2009·32 cites·2 claims
- 0494US10182514B2Thermal interface material structuresIBM·Filed 2016·Granted Jan 15, 2019·8 cites·9 claims
- 0594US9609744B2Area array device connection structures with complimentary warp characteristicsIBM·Filed 2015·Granted Mar 28, 2017·10 cites·14 claims
- 0694US8267701B2Alignment structure having a frame structure and bridging connections to couple and align segments of a socket housingBEAMAN BRIAN S·Filed 2010·Granted Sep 18, 2012·23 cites·25 claims
- 0794US5757998AMultigigabit adaptable transceiver moduleIBM·Filed 1996·Granted May 26, 1998·136 cites·40 claims
- 0893US7342306B2High performance reworkable heatsink and packaging structure with solder release layerIBM·Filed 2005·Granted Mar 11, 2008·22 cites·10 claims
- 0992US11037860B2Multi layer thermal interface materialIBM·Filed 2019·Granted Jun 15, 2021·7 cites·21 claims
- 1092US7606033B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted Oct 20, 2009·18 cites·20 claims
- 1192US6300578B1Pad-on-via assembly techniqueIBM·Filed 2000·Granted Oct 9, 2001·52 cites·7 claims
- 1291US7435622B2High performance reworkable heatsink and packaging structure with solder release layer and method of makingIBM·Filed 2007·Granted Oct 14, 2008·19 cites·7 claims
- 1391US7199309B2Structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2005·Granted Apr 3, 2007·19 cites·11 claims
- 1490US10319609B2Adhesive-bonded thermal interface structuresIBM·Filed 2017·Granted Jun 11, 2019·5 cites·15 claims
- 1589US11289836B2Land grid array electrical contact coatingIBM·Filed 2020·Granted Mar 29, 2022·2 cites·20 claims
- 1689US10779391B2Integrated circuit device assemblyIBM·Filed 2018·Granted Sep 15, 2020·6 cites·16 claims
- 1789US10756009B1Efficient placement of grid array componentsIBM·Filed 2019·Granted Aug 25, 2020·5 cites·10 claims
- 1888US12016127B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2023·Granted Jun 18, 2024·0 cites·20 claims
- 1988US10607859B2Adhesive-bonded thermal interface structuresIBM·Filed 2019·Granted Mar 31, 2020·3 cites·15 claims
- 2087US9472876B1Eye-of-needle compliant pinIBM·Filed 2015·Granted Oct 18, 2016·7 cites·13 claims
- 2186US11228124B1Connecting a component to a substrate by adhesion to an oxidized solder surfaceIBM·Filed 2021·Granted Jan 18, 2022·1 cites·14 claims
- 2285US11310950B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2019·Granted Apr 19, 2022·1 cites·13 claims
- 2385US6784377B2Method and structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2002·Granted Aug 31, 2004·25 cites·2 claims
- 2485US6497582B1LGA connector with integrated gasketIBM·Filed 2001·Granted Dec 24, 2002·36 cites·12 claims
- 2585US6076726APad-on-via assembly techniqueIBM·Filed 1998·Granted Jun 20, 2000·50 cites·7 claims
- 2684US10168383B2Testing printed circuit board assemblyIBM·Filed 2017·Granted Jan 1, 2019·2 cites·20 claims
- 2784US7944698B2Mounting a heat sink in thermal contact with an electronic componentIBM·Filed 2008·Granted May 17, 2011·9 cites·20 claims
- 2884US5769989AMethod and system for reworkable direct chip attach (DCA) structure with thermal enhancementIBM·Filed 1995·Granted Jun 23, 1998·76 cites·7 claims
- 2983US9472877B1Twisted eye-of-needle compliant pinIBM·Filed 2015·Granted Oct 18, 2016·5 cites·20 claims
- 3082US12457693B2Applying a solderable surface to conductive inkIBM·Filed 2023·Granted Oct 28, 2025·0 cites·9 claims
- 3182US10111322B2Implementing reworkable strain relief packaging structure for electronic component interconnectsIBM·Filed 2016·Granted Oct 23, 2018·3 cites·7 claims
- 3281US11278977B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2019·Granted Mar 22, 2022·2 cites·20 claims
- 3381US9913361B2Integrated circuit device assemblyIBM·Filed 2016·Granted Mar 6, 2018·3 cites·17 claims
- 3481US8326754B2Method and system for processing transactionsBANDYCH DAVID W·Filed 2004·Granted Dec 4, 2012·38 cites·26 claims
- 3580USH1471HMetal substrate double sided circuit boardBRAUN DAVID J·Filed 1993·Granted Aug 1, 1995·52 cites·6 claims
- 3679US9247636B2Area array device connection structures with complimentary warp characteristicsIBM·Filed 2013·Granted Jan 26, 2016·4 cites·19 claims
- 3779US6084775AHeatsink and package structures with fusible release layerIBM·Filed 1998·Granted Jul 4, 2000·54 cites·35 claims
- 3877US11784424B2Reliability enhancement of press fit connectorsIBM·Filed 2022·Granted Oct 10, 2023·0 cites·10 claims
- 3977US11751369B2Liquid metal infiltration rework of electronic assemblyIBM·Filed 2022·Granted Sep 5, 2023·0 cites·8 claims
- 4077US7856341B2Heat sinkIBM·Filed 2008·Granted Dec 21, 2010·11 cites·23 claims
- 4177US7517230B2Customizable backer for achieving consistent loading and engagement of array package connectionsIBM·Filed 2008·Granted Apr 14, 2009·6 cites·9 claims
- 4277US6134776AHeatsink and package structure for wirebond chip rework and replacementIBM·Filed 1998·Granted Oct 24, 2000·44 cites·10 claims
- 4376US10653037B2Thermal interface material structuresIBM·Filed 2018·Granted May 12, 2020·1 cites·13 claims
- 4476US8864536B2Implementing hybrid molded solder-embedded pin contacts and connectorsHOFFMEYER MARK K·Filed 2012·Granted Oct 21, 2014·6 cites·9 claims
- 4576US7399185B2Customizable backer for achieving consistent loading and engagement of array package connectionsIBM·Filed 2006·Granted Jul 15, 2008·6 cites·8 claims
- 4676US5873512AApplication of low temperature metallurgical paste to form a bond structure to attach an electronic component to a carrierIBM·Filed 1997·Granted Feb 23, 1999·42 cites·11 claims
- 4775US6912780B2Method and structure for repairing or modifying surface connections on circuit boardsIBM·Filed 2004·Granted Jul 5, 2005·14 cites·8 claims
- 4875US5757073AHeatsink and package structure for wirebond chip rework and replacementIBM·Filed 1996·Granted May 26, 1998·41 cites·22 claims
- 4974US8179693B2Apparatus for electrically connecting two substrates using a land grid array connector provided with a frame structure having power distribution elementsBRODSKY WILLIAM LOUIS·Filed 2007·Granted May 15, 2012·8 cites·17 claims
- 5074US5910644AUniversal surface finish for DCA, SMT and pad on pad interconnectionsIBM·Filed 1997·Granted Jun 8, 1999·49 cites·14 claims
Showing the top 50 of 98 patent records by PatentIndex Score.
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