Inventor · disambiguated record
Guohua Gao
Also filed as: GAO GUOHUA
10 granted patents·1 pending application·32 citations·filing 2004–2021
83Inventor score
Files withSHI LEI4CHINA PETROLEUM & CHEM CORP2TONGFU MICROELECTRONICS CO LTD2CHEN KAIZHI1NANTONG FUJITSU MICROELECT CO1
Top patents by PatentIndex Score
11 records- 0180US9922950B2Method and structure for wafer-level packagingTONGFU MICROELECTRONICS CO LTD·Filed 2017·Granted Mar 20, 2018·3 cites·14 claims
- 0265US10072790B2Stepless rapid extendable multipod with built-in power supplyCHEN KAIZHI·Filed 2015·Granted Sep 11, 2018·7 cites·16 claims
- 0356US9515010B2Semiconductor packaging structure and forming method thereforNANTONG FUJITSU MICROELECT CO·Filed 2014·Granted Dec 6, 2016·1 cites·8 claims
- 0454US12391633B2Method for separating 2-alkylanthracenes and use thereof for producing hydrogen peroxideCHINA PETROLEUM & CHEM CORP·Filed 2020·Granted Aug 19, 2025·0 cites·24 claims
- 0553US9324583B2Packaging methodSHI LEI·Filed 2012·Granted Apr 26, 2016·1 cites·19 claims
- 0653US7536905B2System and method for determining a flow profile in a deviated injection wellSCHLUMBERGER TECHNOLOGY CORP·Filed 2004·Granted May 26, 2009·20 cites·32 claims
- 0753US2023382731A1Method and system for preparing hydrogen peroxideCHINA PETROLEUM & CHEM CORP·Filed 2021·Application pending·0 cites
- 0849US9666550B2Method and structure for wafer-level packagingTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted May 30, 2017·0 cites·11 claims
- 0941US9362173B2Method for chip packageSHI LEI·Filed 2011·Granted Jun 7, 2016·0 cites·17 claims
- 1041US8883627B2Method for chip packagingSHI LEI·Filed 2011·Granted Nov 11, 2014·0 cites·20 claims
- 1135US9497862B2Packaging structureSHI LEI·Filed 2012·Granted Nov 15, 2016·0 cites·16 claims
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