Inventor · disambiguated record
Nathan Ip
Also filed as: IP NATHAN
9 granted patents·3 pending applications·21 citations·filing 2018–2023
80Inventor score
Files withTOKYO ELECTRON LTD12
Top patents by PatentIndex Score
12 records- 0194US11335607B2Apparatus and methods for wafer to wafer bondingTOKYO ELECTRON LTD·Filed 2020·Granted May 17, 2022·6 cites·21 claims
- 0293US10622233B2Amelioration of global wafer distortion based on determination of localized distortions of a semiconductor waferTOKYO ELECTRON LTD·Filed 2018·Granted Apr 14, 2020·14 cites·20 claims
- 0372US11346882B2Enhancement of yield of functional microelectronic devicesTOKYO ELECTRON LTD·Filed 2018·Granted May 31, 2022·1 cites·21 claims
- 0456US11868119B2Method and process using fingerprint based semiconductor manufacturing process fault detectionTOKYO ELECTRON LTD·Filed 2021·Granted Jan 9, 2024·0 cites·14 claims
- 0555US2025029847A1Integrated metrology for process controls in wafer bonding systemTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 0654US11435393B2Enhancement of yield of functional microelectronic devicesTOKYO ELECTRON LTD·Filed 2018·Granted Sep 6, 2022·0 cites·18 claims
- 0753US11594431B2Wafer bonding apparatus and methods to reduce post-bond wafer distortionTOKYO ELECTRON LTD·Filed 2021·Granted Feb 28, 2023·0 cites·20 claims
- 0851US11244873B2Systems and methods for manufacturing microelectronic devicesTOKYO ELECTRON LTD·Filed 2019·Granted Feb 8, 2022·0 cites·21 claims
- 0950US2024250059A1Compliant chuck edge ringTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
- 1049US12479070B2Wafer chuck with tunable stiffness materialTOKYO ELECTRON LTD·Filed 2022·Granted Nov 25, 2025·0 cites·20 claims
- 1149US11574808B2Plasma processing method and plasma processing apparatusTOKYO ELECTRON LTD·Filed 2021·Granted Feb 7, 2023·0 cites·9 claims
- 1249US2024063022A1Wafer bonding process with reduced overlay distortionTOKYO ELECTRON LTD·Filed 2023·Application pending·0 cites
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