Inventor · disambiguated record
Shinji Tachibana
Also filed as: TACHIBANA SHINJI
17 granted patents·7 pending applications·128 citations·filing 1992–2024
91Inventor score
Files withUYEMURA C & CO LTD6MITSUI CHEMICALS INC4ISONO TOSHIHISA3UEMURA KOGYO KK3HITACHI HIGH TECH CORP1
Top patents by PatentIndex Score
24 records- 0194US7220347B2Electrolytic copper plating bath and plating process therewithUYEMURA C & CO LTD·Filed 2005·Granted May 22, 2007·27 cites·20 claims
- 0293US6352775B1Conductive, multilayer-structured resin particles and anisotropic conductive adhesives using the sameTAKEDA CHEMICAL INDUSTRIES LTD·Filed 2000·Granted Mar 5, 2002·55 cites·11 claims
- 0382US9028668B2Electrolytic copper plating bath and method for electroplating using the electrolytic copper plating bathISONO TOSHIHISA·Filed 2010·Granted May 12, 2015·3 cites·16 claims
- 0480US5298559AMulti-layered polymersMITSUBISHI GAS CHEMICAL CO·Filed 1992·Granted Mar 29, 1994·33 cites·12 claims
- 0577US7988842B2Continuous copper electroplating methodUYEMURA C & CO LTD·Filed 2008·Granted Aug 2, 2011·2 cites·4 claims
- 0675US7892411B2Electrolytic copper plating processUYEMURA C & CO LTD·Filed 2008·Granted Feb 22, 2011·1 cites·4 claims
- 0773US10385157B2Blocked isocyanate, coating composition, adhesive composition, and articleMITSUI CHEMICALS INC·Filed 2014·Granted Aug 20, 2019·1 cites·10 claims
- 0872US10163223B2Automatic analyserHITACHI HIGH TECH CORP·Filed 2016·Granted Dec 25, 2018·1 cites·3 claims
- 0971US11072678B2Blocked isocyanate, coating composition, adhesive composition, and articleMITSUI CHEMICALS INC·Filed 2019·Granted Jul 27, 2021·0 cites·9 claims
- 1067US8679317B2Copper electroplating bathISONO TOSHIHISA·Filed 2007·Granted Mar 25, 2014·3 cites·6 claims
- 1165US2024360586A1Method and system for regenerating electrolytic copper plating solutionUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 1261US7507587B2Automatic analysis and control system for electroless composite plating solutionUYEMURA CO LTD C·Filed 2005·Granted Mar 24, 2009·2 cites·7 claims
- 1351US11389818B2Surface treatment apparatus and surface treatment methodUEMURA KOGYO KK·Filed 2018·Granted Jul 19, 2022·0 cites·8 claims
- 1450US9822212B2Polyisocyanate composition, solar cell member covering material, solar cell member with cover layer, microcapsule, and binder for inkMITSUI CHEMICALS INC·Filed 2013·Granted Nov 21, 2017·0 cites·7 claims
- 1550US2009092749A1Manufacture method of buildup circuit boardUYEMURA C & CO LTD·Filed 2008·Application pending·0 cites
- 1649US11421135B2Curable composition, coating material, solar cell coating material, solar cell back sheet coating material, adhesive, solar cell adhesive, solar cell back sheet adhesive, producing method of sheet, and curing agentMITSUI CHEMICALS INC·Filed 2017·Granted Aug 23, 2022·0 cites·11 claims
- 1749US8801912B2Continuous copper electroplating methodOMURA NAOYUKI·Filed 2009·Granted Aug 12, 2014·0 cites·4 claims
- 1847US2013056362A1Manufacture method of buildup circuit boardUYEMURA AND CO LTD C·Filed 2012·Application pending·0 cites
- 1944US9730337B2Plating methodISONO TOSHIHISA·Filed 2012·Granted Aug 8, 2017·0 cites·4 claims
- 2041US2003049169A1Automatic analyzing/controlling device for electroless composite plating solutionFiled 2001·Application pending·0 cites
- 2138US7604755B2Electroconductive resin composition and separator for fuel cellJAPAN COMPOSITE CO LTD·Filed 2004·Granted Oct 20, 2009·0 cites·17 claims
- 2238US2011056840A1Electrolytic plating equipment and electrolytic plating methodUYEMURA C & CO LTD·Filed 2010·Application pending·0 cites
- 2336US2011089044A1Copper electrolytic plating bath and copper electrolytic plating methodUYEMURA C & CO LTD·Filed 2010·Application pending·0 cites
- 2431US2020149180A1Workpiece Holding Jig and Electroplating ApparatusUEMURA KOGYO KK·Filed 2018·Application pending·0 cites
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