Inventor · disambiguated record
Te-Fu Tseng
Also filed as: TSENG TE-FU
9 granted patents·1 pending application·110 citations·filing 1998–2008
88Inventor score
Top patents by PatentIndex Score
10 records- 0176US6849533B2Method for fabricating microelectronic product with attenuated bond pad corrosionTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Feb 1, 2005·25 cites·17 claims
- 0275US6964916B2Image sensor fabrication method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 15, 2005·20 cites·13 claims
- 0374US7507598B2Image sensor fabrication method and structureTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Mar 24, 2009·6 cites·12 claims
- 0468US6956253B2Color filter with resist material in scribe linesTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 18, 2005·13 cites·8 claims
- 0564US6861207B2Method for fabricating microlens with lithographic processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Mar 1, 2005·12 cites·26 claims
- 0661US6242331B1Method to reduce device contact resistance using a hydrogen peroxide treatmentTAIWAN SEMICONDUCTOR MFG·Filed 1999·Granted Jun 5, 2001·25 cites·32 claims
- 0751US8129762B2Image sensorWENG FU-TIEN·Filed 2008·Granted Mar 6, 2012·0 cites·21 claims
- 0842US5874333AProcess for forming a polysilicon layer having improved roughness after POCL3 dopingTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Feb 23, 1999·7 cites·15 claims
- 0936US2005001281A1Process to improve image sensor sensitivityFiled 2004·Application pending·0 cites
- 1031US6563154B1Polysilicon layer having improved roughness after POCl3 dopingTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted May 13, 2003·2 cites·2 claims
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