Inventor · disambiguated record
Jong-Hyun Seok
Also filed as: SEOK JONG HYUN · SEOK JONG W
10 granted patents·7 pending applications·33 citations·filing 2005–2024
85Inventor score
Top patents by PatentIndex Score
17 records- 0189US8951048B2Printed circuit board having terminalsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Feb 10, 2015·9 cites·20 claims
- 0288US11678437B2Semiconductor chip moduleSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0383US9449650B2Memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Sep 20, 2016·8 cites·18 claims
- 0477US9793034B2Semiconductor module having a tab pin with no tie barSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 17, 2017·5 cites·21 claims
- 0575US9786354B2Memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·18 claims
- 0666US12022619B2Semiconductor chip moduleSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 25, 2024·0 cites·20 claims
- 0762US9754658B2Memory module, memory system including the same, and data storage system including the memory moduleSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Sep 5, 2017·2 cites·20 claims
- 0861US2025287505A1Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0960US9406369B2Memory module and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 2, 2016·2 cites·18 claims
- 1055US2024266305A1Semiconductor moduleSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 1153US12075560B2Multi-level printed circuit boards and memory modules including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 1245US8520422B2Semiconductor modules and signal line layout methods thereofSEOK JONG-HYUN·Filed 2010·Granted Aug 27, 2013·1 cites·19 claims
- 1342US2006056988A1Multi-cylinder rotary type compressorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1442US2006056987A1Multi-cylinder compressorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1542US2006056986A1Multi-cylinder compressorSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 1641US2013313714A1Semiconductor device having enhanced signal integritySAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1727US2015349440A1Semiconductor module socket and connection structure of the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →