Inventor · disambiguated record
Chih-Hsien Lin
Also filed as: LIN CHIH-HSIEN · LIN CHIH-HSIEN JASON
60 granted patents·12 pending applications·574 citations·filing 1996–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD23TAIWAN SEMICONDUCTOR MFG15MEDIATEK INC5ASIA OPTICAL CO INC3LU HSIANG-TAI3
Top patents by PatentIndex Score
72 records- 0198US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0297US10269586B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·43 cites·20 claims
- 0396US8970023B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·30 cites·20 claims
- 0493US9209048B2Two step molding grinding for packaging applicationsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Dec 8, 2015·19 cites·20 claims
- 0593US6436787B1Method of forming crown-type MIM capacitor integrated with the CU damascene processTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Aug 20, 2002·75 cites·29 claims
- 0691US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 0789US10347574B2Integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 9, 2019·5 cites·20 claims
- 0887US7122878B2Method to fabricate high reliable metal capacitor within copper back-end processTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Oct 17, 2006·12 cites·14 claims
- 0986US12253558B2Circuit test structure and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 1085US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1185US6426250B1High density stacked MIM capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Jul 30, 2002·35 cites·17 claims
- 1285US2025266417A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1384US8618640B2Method of shielding through silicon vias in a passive interposerLU HSIANG-TAI·Filed 2011·Granted Dec 31, 2013·8 cites·20 claims
- 1484US6559493B2High density stacked mim capacitor structureTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 6, 2003·30 cites·7 claims
- 1583US8664540B2Interposer testing using dummy connectionsLU HSIANG-TAI·Filed 2011·Granted Mar 4, 2014·8 cites·5 claims
- 1682US9590610B2Driver circuit for signal transmission and control method of driver circuitMEDIATEK INC·Filed 2015·Granted Mar 7, 2017·5 cites·19 claims
- 1782US5760960ACascaded self-induced holographyCORNELL RES FOUNDATION INC·Filed 1996·Granted Jun 2, 1998·64 cites·22 claims
- 1880US12354959B2Redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 1980US6903644B2Inductor device having improved quality factorTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jun 7, 2005·28 cites·31 claims
- 2079US11855066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2179US11002788B2Circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 2279US10879162B2Integrated fan-out packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·2 cites·15 claims
- 2379US6916722B2Method to fabricate high reliable metal capacitor within copper back-end processTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jul 12, 2005·22 cites·33 claims
- 2479US6734079B2Microelectronic fabrication having sidewall passivated microelectronic capacitor structure fabricated thereinTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 11, 2004·27 cites·20 claims
- 2579US2025164548A1Method of using circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2679US2024387380A1Redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2778US6845434B2Method for updating parametric data for use in data management systemBENQ CORP·Filed 2002·Granted Jan 18, 2005·25 cites·20 claims
- 2876US10288676B2Circuit test structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 14, 2019·1 cites·20 claims
- 2976US9704829B2Stacked structure of semiconductor chips having via holes and metal bumpsWIN SEMICONDUCTORS CORP·Filed 2015·Granted Jul 11, 2017·2 cites·30 claims
- 3076US9239213B2Sights and methods of operation thereofSINTAI OPTICAL SHENZHEN CO LTD·Filed 2014·Granted Jan 19, 2016·12 cites·20 claims
- 3175US11828790B2Circuit test structure and method of usingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 28, 2023·0 cites·20 claims
- 3275US9590595B2Driver circuit with feed-forward equalizerMEDIATEK INC·Filed 2015·Granted Mar 7, 2017·3 cites·20 claims
- 3375US9479365B2Method for performing loop unrolled decision feedback equalization in an electronic device with aid of voltage feedforward, and associated apparatusMEDIATEK INC·Filed 2015·Granted Oct 25, 2016·3 cites·17 claims
- 3475US2024379428A1Semiconductor structure with pull-in planarization layer and method forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3574US9941239B2Electrostatic discharge protection apparatus and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·2 cites·20 claims
- 3674US8368445B2Delay-locked loopFARADAY TECH CORP·Filed 2011·Granted Feb 5, 2013·5 cites·13 claims
- 3772US11670594B2Redistribution layer featuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·20 claims
- 3871US8987085B2Methods for improving uniformity of cap layersYU CHEN-HUA·Filed 2006·Granted Mar 24, 2015·3 cites·19 claims
- 3970US9379921B2Method for performing data sampling control in an electronic device, and associated apparatusMEDIATEK INC·Filed 2015·Granted Jun 28, 2016·2 cites·20 claims
- 4069US10168124B2Trajectory prediction systemSINTAI OPTICAL SHENZHEN CO LTD·Filed 2016·Granted Jan 1, 2019·5 cites·20 claims
- 4169US9190374B2Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereofWIN SEMICONDUCTORS CORP·Filed 2013·Granted Nov 17, 2015·2 cites·14 claims
- 4267US9491840B2Electrostatic discharge protection apparatus and processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Nov 8, 2016·2 cites·19 claims
- 4367US7897505B2Method for enhancing adhesion between layers in BEOL fabricationTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 1, 2011·2 cites·6 claims
- 4467US7129164B2Method for forming a multi-layer low-K dual damasceneTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 31, 2006·11 cites·35 claims
- 4566US8151995B2Methods and apparatus to prevent mold compound feeder jams in systems to package integrated circuitsCHEN CHIH-CHUNG·Filed 2008·Granted Apr 10, 2012·2 cites·17 claims
- 4666US2022384259A1Semiconductor Structure with Pull-in Planarization Layer and Method Forming the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4763US9040986B2Three dimensional integrated circuit having a resistance measurement structure and method of useCHEN CHING-FANG·Filed 2012·Granted May 26, 2015·1 cites·20 claims
- 4861US7220677B2WAT process to avoid wiring defectsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted May 22, 2007·2 cites·20 claims
- 4961US6732422B1Method of forming resistorsTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted May 11, 2004·8 cites·16 claims
- 5060US8919647B2Sights and methods of operation thereofSINTAI OPTICAL SHENZHEN CO LTD·Filed 2013·Granted Dec 30, 2014·5 cites·20 claims
Showing the top 50 of 72 patent records by PatentIndex Score.
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