Inventor · disambiguated record
Kazunari Imai
Also filed as: IMAI KAZUNARI
10 granted patents·4 pending applications·179 citations·filing 1999–2020
90Inventor score
Top patents by PatentIndex Score
14 records- 0189US6410858B1Multilayered wiring board, a production process for, and semiconductor device using, the sameSHINKO ELECTRIC IND CO·Filed 2000·Granted Jun 25, 2002·49 cites·19 claims
- 0285US6297553B1Semiconductor device and process for producing the sameSHINKO ELECTRIC IND CO·Filed 1999·Granted Oct 2, 2001·63 cites·2 claims
- 0374US7007530B2Bending method and bending deviceAMADA CO LTD·Filed 2001·Granted Mar 7, 2006·11 cites·8 claims
- 0469US6796155B2Sheet thickness detecting method and device therefor in bending machine, reference inter-blade distance detecting method and device therefor, and bending method and bending deviceAMADA CO LTD·Filed 2001·Granted Sep 28, 2004·9 cites·8 claims
- 0568US6285083B1Semiconductor device and mounting structure of a semiconductor deviceSHINKO ELECTRIC IND CO·Filed 2000·Granted Sep 4, 2001·15 cites·10 claims
- 0667US6832526B2Bending method and single elongation value specifying device of bending apparatusAMADA CO LTD·Filed 2001·Granted Dec 21, 2004·8 cites·6 claims
- 0766US6730859B2Substrate for mounting electronic parts thereon and method of manufacturing sameSHINKO ELECTRIC IND CO·Filed 2001·Granted May 4, 2004·12 cites·17 claims
- 0864US7040129B2Sheet working method, sheet working system, and various devices related to such systemAMADA CO LTD·Filed 2001·Granted May 9, 2006·6 cites·14 claims
- 0949US2022288663A1Bending method and bending systemAMADA CO LTD·Filed 2020·Application pending·0 cites
- 1045US2006208374A1Method of manufacturing lens sheetARISAWA SEISAKUSHO KK·Filed 2006·Application pending·0 cites
- 1143US6941784B2Bending method and device thereforAMADA CO LTD·Filed 2001·Granted Sep 13, 2005·6 cites·6 claims
- 1242US8789571B2Prepreg manufacturing deviceMACHII AKIHIKO·Filed 2007·Granted Jul 29, 2014·0 cites·7 claims
- 1337US2001028108A1Semiconductor device having external connecting terminals and process for manufacturing the deviceSHINKO ELECTRIC IND CO·Filed 2001·Application pending·0 cites
- 1429US2003107131A1Semiconductor device having external connecting terminals and process for manufacturing the deviceSHINKO ELECTRIC IND CO·Filed 1999·Application pending·0 cites
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