Inventor · disambiguated record
Hannes Voraberger
Also filed as: VORABERGER HANNES
8 granted patents·4 pending applications·26 citations·filing 2007–2019
82Inventor score
Files withAUSTRIA TECH & SYSTEM TECH4AT & S AUSTRIA TECH & SYSTEMTECHNIK AG3SEBANZ SIMON2VORABERGER HANNES2LANGER GREGOR1
Top patents by PatentIndex Score
12 records- 0190US10410963B1Deformed layer for short electric connection between structures of electric deviceAUSTRIA TECH & SYSTEM TECH·Filed 2018·Granted Sep 10, 2019·11 cites·20 claims
- 0288US11044812B2Component carrier with adhesion promoting shape of wiring structureAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Jun 22, 2021·6 cites·13 claims
- 0375US10349521B2Component carrier with adhesion promoting shape of wiring structureAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Jul 9, 2019·2 cites·14 claims
- 0469US10765005B2Embedding component with pre-connected pillar in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2018·Granted Sep 1, 2020·2 cites·11 claims
- 0561US8541690B2Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic componentVORABERGER HANNES·Filed 2007·Granted Sep 24, 2013·4 cites·21 claims
- 0655US2020053864A1Method of manufacturing a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2019·Application pending·0 cites
- 0751US10492288B2Method of manufacturing a printed circuit boardAUSTRIA TECH & SYSTEM TECH·Filed 2017·Granted Nov 26, 2019·0 cites·4 claims
- 0848US9795025B2Method of manufacturing a printed circuit boardSEBANZ SIMON·Filed 2012·Granted Oct 17, 2017·1 cites·8 claims
- 0946US10880988B2Highly thermally conductive dielectric structure for heat spreading in component carrierAT & S AUSTRIA TECH & SYSTEMTECHNIK AG·Filed 2019·Granted Dec 29, 2020·0 cites·15 claims
- 1043US2011171367A1Method for improving the corrosion resistance of an electronic component, particularly of conductors of a printed circuit boardVORABERGER HANNES·Filed 2009·Application pending·0 cites
- 1135US2013202488A1Optical evanescent field sensorLANGER GREGOR·Filed 2011·Application pending·0 cites
- 1234US2014216792A1Method of manufacturing a rigid-flex printed circuit board or a sub-assembly thereof as well as rigid-flex printed circuit board or a sub-assembly thereofSEBANZ SIMON·Filed 2012·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →