Inventor · disambiguated record
In-Kwon Jeong
Also filed as: ATLAS BORIS · JEONG IN K · JEONG IN KWON
51 granted patents·16 pending applications·1,090 citations·filing 1997–2019
99Inventor score
Top patents by PatentIndex Score
67 records- 0199US7928465B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2010·Granted Apr 19, 2011·194 cites·43 claims
- 0299US7816705B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2009·Granted Oct 19, 2010·57 cites·78 claims
- 0399US7563629B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2005·Granted Jul 21, 2009·42 cites·41 claims
- 0499US7250638B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2005·Granted Jul 31, 2007·107 cites·13 claims
- 0598US8384120B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2011·Granted Feb 26, 2013·19 cites·20 claims
- 0698US7569865B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2004·Granted Aug 4, 2009·43 cites·36 claims
- 0798US7462881B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2007·Granted Dec 9, 2008·23 cites·20 claims
- 0895US7588952B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2005·Granted Sep 15, 2009·32 cites·41 claims
- 0994US7576368B2Method of fabricating vertical structure LEDsLG ELECTRONICS INC·Filed 2007·Granted Aug 18, 2009·26 cites·32 claims
- 1092US6465351B1Method of forming a capacitor lower electrode using a CMP stopping layerSAMSUNG ELECTRONICS CO LTD·Filed 2000·Granted Oct 15, 2002·60 cites·25 claims
- 1189US7004815B2Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersORIOL INC·Filed 2005·Granted Feb 28, 2006·10 cites·17 claims
- 1288US7104867B2Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersORIOL INC·Filed 2005·Granted Sep 12, 2006·8 cites·15 claims
- 1387US7186165B2Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersORIOL INC·Filed 2006·Granted Mar 6, 2007·8 cites·12 claims
- 1486US6905398B2Chemical mechanical polishing tool, apparatus and methodORIOL INC·Filed 2001·Granted Jun 14, 2005·34 cites·19 claims
- 1584US7306002B2System and method for wet cleaning a semiconductor waferKIM YONG BAE·Filed 2003·Granted Dec 11, 2007·36 cites·15 claims
- 1683US6835118B2Rigid plate assembly with polishing pad and method of usingORIOL INC·Filed 2001·Granted Dec 28, 2004·24 cites·20 claims
- 1782US6561881B2System and method for chemical mechanical polishing using multiple small polishing padsORIOL INC·Filed 2001·Granted May 13, 2003·23 cites·5 claims
- 1881US7364496B2Polishing head for polishing semiconductor wafersINOPLA INC·Filed 2007·Granted Apr 29, 2008·11 cites·26 claims
- 1981US7051743B2Apparatus and method for cleaning surfaces of semiconductor wafers using ozoneKIM YONG BAE·Filed 2002·Granted May 30, 2006·30 cites·14 claims
- 2081US6586336B2Chemical-mechanical-polishing stationORIOL INC·Filed 2001·Granted Jul 1, 2003·24 cites·283 claims
- 2179US7022193B2Apparatus and method for treating surfaces of semiconductor wafers using ozoneJEONG IN KWON·Filed 2003·Granted Apr 4, 2006·20 cites·57 claims
- 2278US10453993B1Vertical structure LEDsLG INNOTEK CO LTD·Filed 2019·Granted Oct 22, 2019·1 cites·20 claims
- 2378US9224907B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2014·Granted Dec 29, 2015·1 cites·20 claims
- 2475US6251790B1Method for fabricating contacts in a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 1999·Granted Jun 26, 2001·45 cites·15 claims
- 2574US9882084B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2016·Granted Jan 30, 2018·1 cites·17 claims
- 2673US7069984B2Multi-channel temperature control system for semiconductor processing facilitiesORIOL INC·Filed 2001·Granted Jul 4, 2006·15 cites·20 claims
- 2773US5960317AMethods of forming electrical interconnects on integrated circuit substrates using selective slurriesSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 28, 1999·37 cites·22 claims
- 2872US7775853B2Configurable polishing apparatusKOMICO TECHNOLOGY INC·Filed 2007·Granted Aug 17, 2010·5 cites·28 claims
- 2972US6942545B2Apparatus and method for sequentially polishing and loading/unloading semiconductor wafersORIOL INC·Filed 2001·Granted Sep 13, 2005·9 cites·11 claims
- 3070US7258124B2Apparatus and method for treating surfaces of semiconductor wafers using ozoneJEONG IN KWON·Filed 2006·Granted Aug 21, 2007·3 cites·16 claims
- 3170US6949466B2CMP apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery linesORIOL INC·Filed 2001·Granted Sep 27, 2005·11 cites·25 claims
- 3269US5961377AChemical mechanical polishing systems including brushes and related methodsSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Oct 5, 1999·34 cites·19 claims
- 3368US10600933B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2019·Granted Mar 24, 2020·0 cites·20 claims
- 3468US6575818B2Apparatus and method for polishing multiple semiconductor wafers in parallelORIOL INC·Filed 2001·Granted Jun 10, 2003·12 cites·15 claims
- 3567US10461217B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2019·Granted Oct 29, 2019·0 cites·20 claims
- 3667US6949177B2System and method for processing semiconductor wafers using different wafer processesORIOL INC·Filed 2001·Granted Sep 27, 2005·9 cites·30 claims
- 3764US10243101B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2017·Granted Mar 26, 2019·0 cites·20 claims
- 3863US7238614B2Methods for fabricating one or more metal damascene structures in a semiconductor waferINOPLA INC·Filed 2005·Granted Jul 3, 2007·1 cites·9 claims
- 3962US8896017B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2013·Granted Nov 25, 2014·0 cites·20 claims
- 4062US7591711B2Apparatus and method for polishing semiconductor wafers using one or more polishing surfacesKOMICO TECHNOLOGY INC·Filed 2007·Granted Sep 22, 2009·1 cites·25 claims
- 4162US7225864B2Multi-channel temperature control system for semiconductor processing facilitiesORIOL INC·Filed 2001·Granted Jun 5, 2007·8 cites·30 claims
- 4261US7367866B2Apparatus and method for polishing semiconductor wafers using pivotable load/unload cupsINOPLA INC·Filed 2005·Granted May 6, 2008·1 cites·19 claims
- 4360US9472727B2Vertical structure LEDsLG INNOTEK CO LTD·Filed 2015·Granted Oct 18, 2016·0 cites·20 claims
- 4460US7223153B2Apparatus and method for polishing semiconductor wafers using one or more polishing surfacesINOPLA INC·Filed 2004·Granted May 29, 2007·5 cites·20 claims
- 4560US2015096495A1Apparatus and method of atomic layer depositionMTS NANOTECH INC·Filed 2014·Application pending·0 cites
- 4657US7374471B2Apparatus and method for polishing semiconductor wafers using one or more pivotable load-and-unload cupsINOPLA INC·Filed 2004·Granted May 20, 2008·5 cites·37 claims
- 4757US5960310APolishing methods for forming a contact plugSAMSUNG ELECTRONICS CO LTD·Filed 1997·Granted Sep 28, 1999·22 cites·39 claims
- 4856US2010009599A1Apparatus and method for polishing semiconductor wafers using one or more polishing surfacesKOMICO TECHNOLOGY INC·Filed 2009·Application pending·0 cites
- 4956US2015184295A1Atomic layer deposition apparatusMTS NANOTECH INC·Filed 2013·Application pending·0 cites
- 5052USRE41842EMethods of forming electrical interconnects on integrated circuit substrates using selective slurriesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Oct 19, 2010·0 cites·22 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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