Inventor · disambiguated record
Kazushige Umetsu
Also filed as: UMETSU KAZUSHIGE
29 granted patents·3 pending applications·1,145 citations·filing 1998–2009
97Inventor score
Top patents by PatentIndex Score
32 records- 0198US6667551B2Semiconductor device and manufacturing thereof, including a through-hole with a wider intermediate cavitySEIKO EPSON CORP·Filed 2001·Granted Dec 23, 2003·233 cites·29 claims
- 0297US6608371B2Semiconductor device and method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2001·Granted Aug 19, 2003·243 cites·37 claims
- 0396US6812549B2Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Nov 2, 2004·157 cites·1 claims
- 0495US6852621B2Semiconductor device and manufacturing method therefor, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Feb 8, 2005·82 cites·19 claims
- 0595US6690032B1Electro-optical device and method of manufacture thereof, and electronic instrumentSEIKO EPSON CORP·Filed 2000·Granted Feb 10, 2004·76 cites·12 claims
- 0693US6623178B1Optical module and method of manufacture thereof, semiconductor device, and optical transmission deviceSEIKO EPSON CORP·Filed 2000·Granted Sep 23, 2003·61 cites·21 claims
- 0791US7709159B2Mask, mask forming method, pattern forming method, and wiring pattern forming methodSEIKO EPSON CORP·Filed 2006·Granted May 4, 2010·14 cites·14 claims
- 0891US6563079B1Method for machining work by laser beamSEIKO EPSON CORP·Filed 2000·Granted May 13, 2003·72 cites·17 claims
- 0985US6596634B2Wiring board and fabricating method thereof, semiconductor device and fabricating method thereof, circuit board and electronic instrumentSEIKO EPSON CORP·Filed 2002·Granted Jul 22, 2003·37 cites·16 claims
- 1082US7468310B2Method of machining substrate and method of manufacturing elementSEIKO EPSON CORPROATION·Filed 2005·Granted Dec 23, 2008·9 cites·20 claims
- 1180US6448682B2Motor laminated core, method of manufacturing same, motor and ink jet recording deviceSEIKO EPSON CORP·Filed 2001·Granted Sep 10, 2002·25 cites·7 claims
- 1276US7518294B2Manufacturing method of quartz crystal resonator, apparatus therefor, and quartz crystal resonator manufactured therebySEIKO EPSON CORP·Filed 2005·Granted Apr 14, 2009·8 cites·11 claims
- 1374US7521649B2Laser processing apparatus and laser processing methodSEIKO EPSON CORP·Filed 2004·Granted Apr 21, 2009·15 cites·2 claims
- 1469US7307444B2Testing method and testing apparatus for liquid crystal panelSEIKO EPSON CORP·Filed 2005·Granted Dec 11, 2007·2 cites·6 claims
- 1568US6677237B2Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for themSEIKO EPSON CORP·Filed 2002·Granted Jan 13, 2004·12 cites·17 claims
- 1667US6781089B2Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2002·Granted Aug 24, 2004·9 cites·27 claims
- 1766US7829446B2Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting headsSEIKO EPSON CORP·Filed 2007·Granted Nov 9, 2010·2 cites·9 claims
- 1864US7411649B2Method for manufacturing a crystal deviceSEIKO EPSON CORP·Filed 2005·Granted Aug 12, 2008·4 cites·11 claims
- 1964US6507003B2Method and apparatus for laser processingSEIKO EPSON CORP·Filed 2001·Granted Jan 14, 2003·10 cites·15 claims
- 2062US7241967B2Method and apparatus for cutting electrical wiring line on a substrate, and method and apparatus for manufacturing electronic deviceSEIKO EPSON CORP·Filed 2004·Granted Jul 10, 2007·7 cites·13 claims
- 2162US6775958B2Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged productSEIKO EPSON CORP·Filed 2001·Granted Aug 17, 2004·9 cites·8 claims
- 2260US7440074B2Method for repair of liquid crystal display device light point defects using detection of corrective laser light in real timeSEIKO EPSON CORP·Filed 2005·Granted Oct 21, 2008·1 cites·2 claims
- 2358US6249072B1Motor laminated core, method of manufacturing same, motor and ink jet recording deviceSEIKO EPSON CORP·Filed 1998·Granted Jun 19, 2001·20 cites·18 claims
- 2458US2010089883A1Workpiece splitting method and object producing methodSEIKO EPSON CORP·Filed 2009·Application pending·0 cites
- 2556US7387739B2Mask and method of manufacturing the same, electroluminescent device and method of manufacturing the same, and electronic instrumentSEIKO EPSON CORP·Filed 2003·Granted Jun 17, 2008·2 cites·8 claims
- 2656US6424048B1Semiconductor chip, semiconductor device, circuit board and electronic equipment and production methods for themSEIKO EPSON CORP·Filed 1999·Granted Jul 23, 2002·18 cites·24 claims
- 2755US6063301ACrystal display processing method and crystal wafer manufacturing methodSEIKO EPSON CORP·Filed 1998·Granted May 16, 2000·14 cites·20 claims
- 2849US7070700B2Method of laser processing and head for ejecting dropletSEIKO EPSON CORP·Filed 2003·Granted Jul 4, 2006·2 cites·16 claims
- 2947US6918705B2Optical module and method of manufacture thereof, semiconductor device, and optical transmission deviceSEIKO EPSON CORP·Filed 2003·Granted Jul 19, 2005·1 cites·10 claims
- 3045US2006113284A1Manufacturing method of substrateUMETSU KAZUSHIGE·Filed 2005·Application pending·0 cites
- 3141US2005150875A1Package sealing method, manufacturing method of electronic device modules, sealing apparatus, and packaged productSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
- 3236US7406756B2Method for manufacturing a piezoelectric resonatorSEIKO EPSON CORP·Filed 2004·Granted Aug 5, 2008·0 cites·3 claims
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