Inventor · disambiguated record
David J. Alcoe
Also filed as: ALCOE DAVID · ALCOE DAVID J · ALCOE DAVID JAMES
40 granted patents·2 pending applications·1,572 citations·filing 1996–2010
98Inventor score
Top patents by PatentIndex Score
42 records- 0197US7014094B2Method of reforming reformable members of an electronic package and the resultant electronic packageIBM·Filed 2005·Granted Mar 21, 2006·48 cites·26 claims
- 0296US6665187B1Thermally enhanced lid for multichip modulesIBM·Filed 2002·Granted Dec 16, 2003·108 cites·18 claims
- 0396US5877043AElectronic package with strain relief means and method of makingIBM·Filed 1998·Granted Mar 2, 1999·243 cites·15 claims
- 0494US6654250B1Low-stress compressive heatsink structureIBM·Filed 2002·Granted Nov 25, 2003·73 cites·14 claims
- 0592US6740959B2EMI shielding for semiconductor chip carriersIBM·Filed 2001·Granted May 25, 2004·97 cites·28 claims
- 0690US7629684B2Adjustable thickness thermal interposer and electronic package utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2006·Granted Dec 8, 2009·20 cites·19 claims
- 0790US6816385B1Compliant laminate connectorIBM·Filed 2000·Granted Nov 9, 2004·46 cites·43 claims
- 0890US6631078B2Electronic package with thermally conductive standoffIBM·Filed 2002·Granted Oct 7, 2003·62 cites·17 claims
- 0989US7851906B2Flexible circuit electronic package with standoffsENDICOTT INTERCONNECT TECH INC·Filed 2007·Granted Dec 14, 2010·19 cites·24 claims
- 1088US5760465AElectronic package with strain relief meansIBM·Filed 1996·Granted Jun 2, 1998·97 cites·21 claims
- 1187US6992379B2Electronic package having a thermal stretching layerIBM·Filed 2001·Granted Jan 31, 2006·40 cites·22 claims
- 1287US6879492B2Hyperbga buildup laminateIBM·Filed 2001·Granted Apr 12, 2005·36 cites·35 claims
- 1387US6744132B2Module with adhesively attached heat sinkIBM·Filed 2002·Granted Jun 1, 2004·46 cites·9 claims
- 1487US6667557B2Method of forming an apparatus to reduce thermal fatigue stress on flip chip solder connectionsIBM·Filed 2003·Granted Dec 23, 2003·43 cites·16 claims
- 1586US6570259B2Apparatus to reduce thermal fatigue stress on flip chip solder connectionsIBM·Filed 2001·Granted May 27, 2003·43 cites·19 claims
- 1685US6830960B2Stress-relieving heatsink structure and method of attachment to an electronic packageIBM·Filed 2002·Granted Dec 14, 2004·34 cites·12 claims
- 1784US5786635AElectronic package with compressible heatsink structureIBM·Filed 1996·Granted Jul 28, 1998·54 cites·27 claims
- 1882US6703704B1Stress reducing stiffener ringIBM·Filed 2002·Granted Mar 9, 2004·35 cites·22 claims
- 1982US6051982AElectronic component test apparatus with rotational probe and conductive spaced apart meansIBM·Filed 1997·Granted Apr 18, 2000·52 cites·36 claims
- 2081US7186590B2Thermally enhanced lid for multichip modulesIBM·Filed 2003·Granted Mar 6, 2007·26 cites·20 claims
- 2181US6815837B2Electronic package with strengthened conductive padENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Nov 9, 2004·20 cites·17 claims
- 2281US5947750AElastomeric structure with multi-layered elastomer and constraining baseIBM·Filed 1997·Granted Sep 7, 1999·50 cites·35 claims
- 2377US5863814AElectronic package with compressible heatsink structureIBM·Filed 1997·Granted Jan 26, 1999·37 cites·15 claims
- 2476US7087846B2Pinned electronic package with strengthened conductive padENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Aug 8, 2006·15 cites·11 claims
- 2575US6455924B1Stress-relieving heatsink structure and method of attachment to an electronic packageIBM·Filed 2001·Granted Sep 24, 2002·19 cites·22 claims
- 2675US6245186B1Electronic package with compressible heatsink structureIBM·Filed 1999·Granted Jun 12, 2001·33 cites·12 claims
- 2774US7972178B2High density connector for interconnecting fine pitch circuit packaging structuresENDICOTT INTERCONNECT TECH INC·Filed 2010·Granted Jul 5, 2011·4 cites·10 claims
- 2872US6720502B1Integrated circuit structureIBM·Filed 2000·Granted Apr 13, 2004·17 cites·12 claims
- 2971US5873740AElectrical connector system with member having layers of different durometer elastomeric materialsIBM·Filed 1998·Granted Feb 23, 1999·29 cites·30 claims
- 3069US6583354B2Method of reforming reformable members of an electronic package and the resultant electronic packageIBM·Filed 1999·Granted Jun 24, 2003·22 cites·27 claims
- 3168US5804984AElectronic component test apparatus with rotational probeIBM·Filed 1996·Granted Sep 8, 1998·30 cites·32 claims
- 3266US6949415B2Module with adhesively attached heat sinkIBM·Filed 2004·Granted Sep 27, 2005·12 cites·8 claims
- 3364US7015574B2Electronic device carrier adapted for transmitting high frequency signalsIBM·Filed 2002·Granted Mar 21, 2006·11 cites·19 claims
- 3463US6255136B1Method of making electronic package with compressible heatsink structureIBM·Filed 1999·Granted Jul 3, 2001·20 cites·15 claims
- 3561US7109732B2Electronic component test apparatusENDICOTT INTERCONNECT TECH INC·Filed 2003·Granted Sep 19, 2006·8 cites·14 claims
- 3660US6887779B2Integrated circuit structureIBM·Filed 2003·Granted May 3, 2005·8 cites·20 claims
- 3755US7088008B2Electronic package with optimized circuitization patternIBM·Filed 2003·Granted Aug 8, 2006·4 cites·25 claims
- 3854US6978542B2Method of reforming reformable members of an electronic package and the resultant electronic packageIBM·Filed 2003·Granted Dec 27, 2005·3 cites·10 claims
- 3952US7213336B2Hyperbga buildup laminateIBM·Filed 2004·Granted May 8, 2007·3 cites·25 claims
- 4048US2008164300A1Method of making circuitized substrate with solder balls having roughened surfaces, method of making electrical assembly including said circuitized substrate, and method of making multiple circuitized substrate assemblyENDICOTT INTERCONNECT TECH INC·Filed 2007·Application pending·0 cites
- 4141US2004238970A1Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing sameENDICOTT INTERCONNECT TECH INC·Filed 2004·Application pending·0 cites
- 4235US6060341AMethod of making an electronic packageIBM·Filed 1998·Granted May 9, 2000·5 cites·18 claims
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