Inventor · disambiguated record
Eisuke Morisaki
Also filed as: MORISAKI EISUKE
9 granted patents·3 pending applications·128 citations·filing 2000–2014
88Inventor score
Top patents by PatentIndex Score
12 records- 0190US6473993B1Thermal treatment method and apparatusTOKYO ELECTRON LTD·Filed 2000·Granted Nov 5, 2002·53 cites·9 claims
- 0279US6630991B2Thermal processing apparatusTOKYO ELECTRON LTD·Filed 2001·Granted Oct 7, 2003·25 cites·14 claims
- 0376US8696814B2Film deposition apparatus and film deposition methodMORISAKI EISUKE·Filed 2007·Granted Apr 15, 2014·6 cites·12 claims
- 0472US8328943B2Film forming apparatus and methodMORISAKI EISUKE·Filed 2007·Granted Dec 11, 2012·5 cites·7 claims
- 0568US8440270B2Film deposition apparatus and methodMORISAKI EISUKE·Filed 2007·Granted May 14, 2013·4 cites·19 claims
- 0668US6488407B1Radiation temperature measuring method and radiation temperature measuring systemTOKYO ELECTRON LTD·Filed 2000·Granted Dec 3, 2002·14 cites·4 claims
- 0766US6467952B2Virtual blackbody radiation system and radiation temperature measuring systemTOKYO ELECTRON LTD·Filed 2000·Granted Oct 22, 2002·12 cites·9 claims
- 0855US8409460B2Forming method of amorphous carbon film, amorphous carbon film, multilayer resist film, manufacturing method of semiconductor device, and computer-readable storage mediumISHIKAWA HIRAKU·Filed 2008·Granted Apr 2, 2013·1 cites·7 claims
- 0951USD766850SWafer holder for manufacturing semiconductorTOKYO ELECTRON LTD·Filed 2014·Granted Sep 20, 2016·8 cites·1 claims
- 1039US2014174364A1Heat treatment deviceNAKAO KEN·Filed 2012·Application pending·0 cites
- 1138US2016148829A1Device and method for transferring substrate for forming compund semiconductor film, and system and method for forming compund semiconductor filmTOKYO ELECTRON LTD·Filed 2014·Application pending·0 cites
- 1236US2012128892A1Surface processing method and surface processing apparatusTOYODA NORIAKI·Filed 2011·Application pending·0 cites
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